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Lithographic apparatus and device manufacturing method

A technology of lithography and components, applied in semiconductor/solid-state device manufacturing, photolithography exposure equipment, micro-lithography exposure equipment, etc., can solve imaging errors, cannot clamp masks, increase masks and/or substrates Inertia and other issues

Active Publication Date: 2010-07-07
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it has been found that this increases the inertial forces of the mask and / or substrate and increases the risk of minor and excessive slippage of the mask and / or substrate
resulting in imaging errors
In particular, it has been found that conventional vacuum grippers will not be able to grip the mask with sufficient force when the mask table is subjected to increased inertial forces relative to the mask table

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

Experimental program
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Embodiment Construction

[0020] figure 1 A lithography apparatus according to an embodiment of the present invention is schematically shown. The unit includes:

[0021] an illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation or DUV radiation);

[0022] a support structure (e.g. a mask table, also known as a reticle stage) MT configured to support a patterning device (e.g. a mask, also known as a reticle) MA and configured to Precise positioning of the first positioning device PM connection;

[0023] A substrate table (eg wafer table) WT configured to hold a substrate (eg resist coated wafer) W is connected to a second positioner PW configured to precisely position the substrate according to certain parameters.

[0024] A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning member MA onto a target portion C of the substrate W (eg comprising one or more dies).

[...

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PUM

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Abstract

A lithographic apparatus is disclosed that has a support structure constructed to support a patterning object, the patterning object being capable of imparting a radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, or both, wherein the support structure, the substrate table, or both, has a contact surface with which the patterning object, the substrate, or both, are configured to be in contact, respectively, the contact surface having a plurality of sub-contact surfaces to increase a mutual adhesion between the support structure and the patterning object, the substrate table and the substrate, or both.

Description

technical field [0001] The present invention relates to a photolithographic apparatus and a method of manufacturing a device. Background technique [0002] A lithographic apparatus is an apparatus that applies a desired pattern to a substrate, usually a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, the patterning device may be referred to either as a mask or a plate, and it may be used to create a circuit pattern formed on an individual layer of the IC. The pattern may be transferred onto a target portion (eg comprising a portion, one or more dies) of a substrate (eg a silicon wafer). Typically this pattern is transferred by imaging onto a layer of radiation sensitive material (resist) applied to the substrate. Typically, a single substrate will contain a grid of adjacent target portions that are patterned sequentially. Known lithographic apparatuses include so-called ste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/00
CPCG03F7/707G03F7/70716H01L21/683
Inventor D·-J·比杰弗特
Owner ASML NETHERLANDS BV
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