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Connecting element and circuit connecting device using the connecting element

A connection element and circuit connection technology, applied in the field of circuit connection devices, can solve the problem of difficulty in achieving the exact opposite degree of the conducting parts of the connection element and the like

Inactive Publication Date: 2007-01-24
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the development of miniaturization of components and high density of circuits, the size of the contacts provided in the connection elements is getting smaller and smaller, and the arrangement density of the contacts is getting higher and higher. Therefore, for the positioning of the connection terminals, It is becoming more and more difficult to achieve the degree of accurate alignment of the multiple contacts of the connecting component with the multiple conductions of the main substrate

Method used

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  • Connecting element and circuit connecting device using the connecting element
  • Connecting element and circuit connecting device using the connecting element
  • Connecting element and circuit connecting device using the connecting element

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Embodiment Construction

[0066] figure 1 It is an exploded perspective view showing the connection element of the first embodiment of the present invention, figure 2 (A) is the plan view of the support body that is arranged on the connection element, figure 2 (B) is a front view of the support body, image 3 It is a perspective view of the planar development of the connecting piece installed in the connecting element, Figure 4 It is a partially enlarged perspective view of the above connecting piece.

[0067] figure 1 The connection element 1 shown is defined as follows: the Y direction is the length direction, the X direction is the width direction, and the Z direction is the thickness direction. Hereinafter, the dimension in the longitudinal direction is referred to as the vertical dimension, the dimension in the width direction is referred to as the width dimension, and the dimension in the thickness direction is referred to as the thickness dimension.

[0068] The connecting element 1 has ...

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Abstract

To provide a connection element and a circuit connection device using the same capable of positioning and mounting the connection element provided with an elastic contact to a circuit member in high accuracy. A flexible base plate 11 is wound around a supporting body 2 of the connection element 1, and flexible contacts 15, 16 are formed on the flexible base plate 11. A positioning hole 7 is formed on the supporting body 2. A first positioning part 30 is positioned and soldered on a metal layer 24 formed on a mother base plate 21, and a second positioning part 40 is positioned and soldered on a metal layer 27 formed on an electronic part 22. The positioning hole 7 of the connection element 1 is inserted through the first positioning part 30, and the first positioning part 30 is fitted to the second positioning part 40 in jagged form. By this, the connection element 1 is positioned by the mother base plate 21 and the electronic part 22.

Description

technical field [0001] The present invention relates to a connecting element with multiple elastic contacts connected to conducting parts of circuit components such as circuit substrates and IC components, and a circuit connecting device for positioning and connecting the connecting element and the circuit components. Background technique [0002] In the following Patent Document 1, it is disclosed that a plurality of helical elastic contacts are provided on one surface of a substrate-shaped support body, and a one-to-one connection with the above-mentioned elastic contacts is provided on the other surface. Connecting elements with multiple fixed joints. [0003] The ball-shaped connection terminal of the IC package is pressed against the elastic contact of the connection element in a state where the fixed contact of the connection element is connected to a plurality of conduction portions formed on the main substrate. Then, the above-mentioned spherical connection terminal...

Claims

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Application Information

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IPC IPC(8): H01R33/76H01L21/66
Inventor 吉田信冈本泰志堂野浩司奥田伸幸
Owner ALPS ALPINE CO LTD
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