Continuous production method for both-sided conductor polyimide laminate
A technology of polyimide and manufacturing method, applied in the directions of printed circuit manufacturing, chemical instruments and methods, manufacturing printed circuit precursors, etc. The effect of preventing complex wrinkles and preventing appearance defects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0078] Hereinafter, embodiments of the present invention will be specifically described based on examples. In the following examples, the coefficient of linear expansion, curling and adhesion of single-sided copper-clad products were measured by the following methods.
[0079] That is, the coefficient of linear expansion is calculated using a thermomechanical analyzer (TMA 100) manufactured by Seiko Electronics Co., Ltd., after heating up to 250°C, cooling at a rate of 10°C / min, and calculating the average line between 240°C and 100°C. derived from the coefficient of expansion. The curling of single-sided copper-clad products is to measure the radius of curvature of copper-clad products with a size of 100mm×100mm after heat treatment and imidization.
[0080] The adhesive strength of single-sided copper-clad products is the value obtained when the copper foil is peeled off at a speed of 50 mm / min in the direction of 180° using a pattern with a conductor width of 3 mm in accor...
Synthetic example 1
[0087] While feeding nitrogen into the glass reactor, put 2532g of N,N-dimethylacetamide, then add 0.5mol of DDE and 0.5mol of MABA under the condition of stirring, then make it dissolve completely. The solution was cooled to 10°C, and 1 mol of PMDA was added little by little to keep the reaction solution at a temperature less than or equal to 30°C. After the addition was completed, continue to stir at room temperature for 2 hours to complete the polymerization reaction. The resulting polyamide The imine precursor solution has a polymer concentration of 15% by weight, and the apparent viscosity measured at 25° C. using a B-type viscometer is 1000 mPa·s.
Synthetic example 2
[0089] Except having used 1 mol of DDE as a diamine component, and having used 1 mol of BTDA as an acid anhydride component, it carried out similarly to the synthesis example 1, and prepared the polyimide precursor solution. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 300 mPa·s.
[0090] (Production of single-sided conductive layered body)
[0091] On the roughened surface of a 35 μm roll-shaped electrolytic copper foil (manufactured by Nikko Gould), the polyimide precursor solution 2 prepared in Synthesis Example 2 was uniformly coated with a thickness of 12 μm by a die coater, and then The solvent was removed by continuous treatment in a hot air drying oven at 120°C. Then, on the polyimide precursor layer, the polyimide precursor solution 1 prepared in Synthesis Example 1 was uniformly coated with a thickness of 200 μm by a reverse roll coater, and hot air a...
PUM
| Property | Measurement | Unit |
|---|---|---|
| surface roughness | aaaaa | aaaaa |
| coefficient of linear thermal expansion | aaaaa | aaaaa |
| shear viscosity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More