Continuous production method for both-sided conductor polyimide laminate
A technology of polyimide and its manufacturing method, which is applied in the fields of printed circuit manufacturing, chemical instruments and methods, and the manufacture of printed circuit precursors, etc., which can solve the problems of low production efficiency, easy involvement of foreign matter, etc., and achieve reduced adhesion, Effects of preventing complicated wrinkles and preventing appearance defects
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[0075] Hereinafter, based on an Example and a comparative example, embodiment of this invention is demonstrated concretely. In the following examples and comparative examples, the coefficient of linear expansion, curling and adhesive force of single-sided copper-clad products were measured by the following methods.
[0076] That is, the linear expansion coefficient is obtained by calculating the average linear expansion coefficient between 240 °C and 100 °C using a thermomechanical analyzer (TMA100) manufactured by Seiko Electronics Industries, Ltd., after heating to 250 °C and cooling at a rate of 10 °C / min Find out. The curling of single-sided copper-clad products is to measure the radius of curvature of copper-clad products with a size of 100mm×100mm after heat treatment and imidization.
[0077] The adhesive strength of single-sided copper-clad products is the value obtained when the copper foil is peeled off at a speed of 50mm / min in the direction of 180° using a pattern...
Synthetic example 1
[0084] 2532 g of N,N-dimethylacetamide was put into a glass reactor while blowing nitrogen gas, then 0.5 mol of DDE and 0.5 mol of MABA were added with stirring, and then completely dissolved. The solution was cooled to 10° C., and 1 mol PMDA was added little by little to keep the temperature of the reaction solution less than or equal to 30° C. After the addition was completed, stirring was continued at room temperature for 2 hours to complete the polymerization reaction. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 1000 mPa·s.
Synthetic example 2
[0086] Except having used 1 mol of DDE as a diamine component, and having used 1 mol of BTDA as an acid anhydride component, it carried out similarly to the synthesis example 1, and prepared the polyimide precursor solution. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 300 mPa·s.
[0087] (manufacturing of laminates)
[0088] On the roughened surface of a 35 μm roll-shaped electrolytic copper foil (manufactured by Nikko Gould), the polyimide precursor solution 2 prepared in Synthesis Example 2 was uniformly coated with a thickness of 12 μm by a die coater, and then Continuous treatment was performed with a hot air drying oven at 120°C to remove the solvent. Next, on the polyimide precursor layer, the polyimide precursor solution 1 prepared in Synthesis Example 1 was uniformly coated with a thickness of 200 μm by a reverse roll coater, and then hot air at 120° C...
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