Continuous production method for both-sided conductor polyimide laminate
A polyimide and manufacturing method technology, applied in the directions of printed circuit manufacturing, chemical instruments and methods, manufacturing printed circuit precursors, etc., can solve the problems of low production efficiency, easy to be involved in foreign matter, etc. The effect of preventing complex wrinkles and preventing appearance defects
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[0078] Hereinafter, embodiments of the present invention will be specifically described based on examples. In the following examples, the coefficient of linear expansion, curling and adhesion of single-sided copper-clad products were measured by the following methods.
[0079] That is, the coefficient of linear expansion is calculated by using a thermomechanical analyzer (TMA100) manufactured by Seiko Electronics Co., Ltd., after heating up to 250°C, cooling at a rate of 10°C / min, and calculating the average linear expansion between 240°C and 100°C derived from the coefficient. The curling of single-sided copper-clad products is to measure the radius of curvature of copper-clad products with a size of 100mm×100mm after heat treatment and imidization.
[0080] The adhesive strength of single-sided copper-clad products is the value obtained when the copper foil is peeled off at a speed of 50mm / min in the direction of 180° using a pattern with a conductor width of 3mm in accorda...
Synthetic example 1
[0087] 2532 g of N,N-dimethylacetamide was put into a glass reactor while blowing nitrogen gas, then 0.5 mol of DDE and 0.5 mol of MABA were added with stirring, and then completely dissolved. The solution was cooled to 10° C., and 1 mol of PMDA was added little by little to keep the reaction solution at a temperature of 30° C. or less. After the addition was completed, stirring was continued at room temperature for 2 hours to complete the polymerization reaction. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 1000 mPa·s.
Synthetic example 2
[0089] Except having used 1 mol of DDE as a diamine component, and having used 1 mol of BTDA as an acid anhydride component, it carried out similarly to the synthesis example 1, and prepared the polyimide precursor solution. The obtained polyimide precursor solution had a polymer concentration of 15% by weight, and an apparent viscosity measured at 25° C. with a B-type viscometer was 300 mPa·s.
[0090] (Production of single-sided conductive layered body)
[0091] On the roughened surface of a 35 μm roll-shaped electrolytic copper foil (manufactured by Nikko Gould), the polyimide precursor solution 2 prepared in Synthesis Example 2 was uniformly coated with a thickness of 12 μm by a die coater, and then The solvent was removed by continuous treatment in a hot air drying oven at 120°C. Then, on the polyimide precursor layer, the polyimide precursor solution 1 prepared in Synthesis Example 1 was uniformly coated with a thickness of 200 μm by a reverse roll coater, and hot air a...
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