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Cable assembly for an information handling system

a technology of information handling system and cable assembly, which is applied in the direction of cross-talk/noise/interference reduction, fixed connections, printed circuit aspects, etc., can solve the problems of cable routing and bending difficulties, cross-talk noise, impedance mismatches

Active Publication Date: 2019-07-30
DELL PROD LP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution allows for more flexible and cost-effective cable assemblies with improved signal integrity and mechanical strength, reducing impedance mismatches and cross-talk noise, and simplifying the manufacturing process.

Problems solved by technology

When large numbers of cables are required in an information handling system, difficulties can arise with routing and bending of the cables.
Further problems can occur with the termination of differential pair cables that cause impedance mismatches and cross-talk noise.

Method used

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  • Cable assembly for an information handling system
  • Cable assembly for an information handling system
  • Cable assembly for an information handling system

Examples

Experimental program
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Embodiment Construction

[0017]The illustrative embodiments provide an information handling system (IHS), a cable assembly, and a method of manufacturing the cable assembly. The cable assembly includes a printed circuit board having a first surface and a second surface. A first post and a second post extend from one side of the printed circuit board. A first signal pad, a second signal pad, and a first ground pad are each coupled to the first surface. A first cable has a first signal wire at least partially covered by a first insulator and a second signal wire at least partially covered by a second insulator. The first cable further has a first ground shield at least partially covering the first and second insulators. A first end of a first cable is mounted between the first and second posts. A first conductive attachment couples the first signal wire to the first signal pad, a second conductive attachment couples the second signal wire to the second signal pad, and a third conductive attachment couples the...

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PUM

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Abstract

A cable assembly includes a printed circuit board having a first surface and a second surface. A first post and a second post extend from one side of the printed circuit board. A first signal pad, a second signal pad, and a first ground pad are each coupled to the first surface. A first cable has a first signal wire at least partially covered by a first insulator and a second signal wire at least partially covered by a second insulator. The first cable further has a first ground shield at least partially covering the first and second insulators. A first end of a first cable is mounted between the first and second posts. A conductive attachment couples the first ground shield to the first ground pad.

Description

BACKGROUND1. Technical Field[0001]The present disclosure generally relates to information handling systems and in particular to a cable assembly for an information handling system.2. Description of the Related Art[0002]As the value and use of information continue to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and / or communicates information or data for business, personal, or other purposes, thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be proces...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K1/11H01R43/02H01R12/62H05K3/34H05K1/02
CPCH05K1/112H01R12/62H01R43/0256H05K1/0219H05K3/3405H05K2201/10356H05K1/0245H05K1/0298H05K2201/09145
Inventor FARKAS, SANDORMUTNURY, BHYRAV M.
Owner DELL PROD LP