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Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

a technology of electronic assembly and electronic components, applied in the direction of identification means, instruments, lighting and heating apparatus, etc., can solve the problems of limited brightness, limited display resolution, and limited ability of existing led signage and displays

Active Publication Date: 2005-08-18
DISPLAY VECTORS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The patent describes an improved method for cooling LED displays by using an array of electrical conductors and a screen for coolant fluid flow. The LEDs are mounted on insulated metallic wires that act as both electrical and thermal conductors. The screen can be attached to a substrate or a superstrate for structural strength. The method also includes selectively energizing and cooling the LEDs to adjust the display. The technical effects of this invention include improved cooling efficiency, flexibility in display design, and better control over display brightness and contrast."

Problems solved by technology

In addition to cost, weight and volume issues or problems, these displays are limited in resolution as a result of the LED package size (typically 0.2 inches in diameter), or about 300 times the plan form area of a bare LED (8000 times the volume), and they are limited in brightness by the small number of LEDs that can be placed in a given area, and also by the thermal resistance of the package and module design.
Also, existing LED signage and displays have limited ability to tailor the radiation emission pattern to the needs of the target / audience and thereby increase efficiency.
There is need for improvements in the provision and operation of LED display assemblies that overcome problems of heating and inability to adequately transfer or dispose of heat generated by LED operation; problems of inadequate LED support on substrates or circuit boards; problems resulting from lack of flexibility of the LED support means; difficulties in manufacturing close packed LED displays; and other problems and difficulties as will appear.

Method used

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  • Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
  • Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
  • Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

Examples

Experimental program
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Embodiment Construction

[0077]FIG. 1 shows a screen 10 forming a grid of electrical conductors. As illustrated, the conductors include like primary conductors 11 extending generally in one direction, and designated as an X-direction; and secondary conductors 12 extending generally in another direction, designated as a Y-direction. As shown, the primary conductors preferably have overall diameters d1 or cross sections greater than the overall diameters d2 or cross sections of the secondary conductors, and the latter extend over and under the conductor 11 in a weaving or mesh relationship as at 12a and 12a′. There is space as at 15 between successive parallel conductors 11; and there is space as at 16 between successive undulating conductors 12, whereby coolant can flow downwardly through the screen via spaces 15 and 16 and near or adjacent diodes, to remove heat generated by diode operation.

[0078] Light emitting diodes are located or mounted in an array on various conductors, as shown on crests of conducto...

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PUM

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Abstract

An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during diode operation, and the array configured for passing coolant fluid for transfer of heat to the fluid. LED packages adjustable relative to a mounting grid, are also provided.

Description

BACKGROUND OF THE INVENTION [0001] This application is a continuation-in-part of prior pending U.S. application Ser. No. 10 / 625,185 filed Jul. 23, 2003. [0002] The methods described and claimed herein relate generally to provision of electronic-optical packages, and more particularly to provision of grids or arrays of such packages supported in such manner as to facilitate their installation and use as in closely assembled or packed configurations. [0003] Large-scale LED displays are typified by the use of T 1¾ (5 mm) packaged LEDs soldered to rigid printed circuit boards. Such circuit board / modules typically contain a large number of LEDs and must be replaced to correct for the failure of even a single LED. In addition to cost, weight and volume issues or problems, these displays are limited in resolution as a result of the LED package size (typically 0.2 inches in diameter), or about 300 times the plan form area of a bare LED (8000 times the volume), and they are limited in bright...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G09F9/33
CPCG09F9/33H01L2224/48091H01L2224/45147H01L2224/45124H01L2924/00014H01L2924/00D03D1/0088D10B2401/18
Inventor POPOVICH, JOHN M.
Owner DISPLAY VECTORS LLC
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