Ball grid array package and process for manufacturing same

Abstract

A ball grid array integrated circuit package is manufactured by mounting a semiconductor die, to a first surface of a substrate such that bumps on the semiconductor die are electrically connected to conductive traces of the substrate. At least one collapsible spacer is mounted to at least one of a heat spreader, the semiconductor die and the substrate. The heat spreader is fixed to the at least one of the first surface of the substrate and the semiconductor die such that the at least one collapsible spacer is disposed therebetween. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a Continuation of U.S. application Ser. No. 10 / 866,702, filed Jun. 15, 2004, which is a Division of U.S. application Ser. No. 10 / 647,696 (now U.S. Pat. No. 6,933,176), filed Aug. 25, 2003, which is a Continuation-In-Part of U.S. application Ser. No. 10 / 643,961 (now U.S. Pat. No. 6,987,032), filed Aug. 20, 2003, which is a Continuation-In-Part of U.S. application Ser. No. 10 / 323,657 (now U.S. Pat. No. 6,979,594), filed Dec. 20, 2002, which is a Continuation-In-Part of U.S. application Ser. No. 10 / 197,832 (now U.S. Pat. No. 6,800,948), filed Jul. 19, 2002. These applications, in their entirety, are incorporated herein by reference.FIELD OF THE INVENTION [0002] The present invention relates in general to integrated circuit packaging, and in particular to an improved ball grid array package with enhanced thermal characteristics and a unique method of manufacturing the ball grid array package. BACKGROUND OF THE INVENTION ...

AI Technical Summary

Benefits of technology

This configuration improves thermal dissipation by providing a direct path for heat from the semiconductor die to the heat spreader, reduces electrical impedance by eliminating wire bonds, and allows for the manufacture of multiple packages with integrated heat spreaders in a single mold shot, enhancing both thermal and electrical performance.

Problems solved by technology

However, typical PBGA packages include a convoluted signal path, giving rise to high impedance and an inefficient thermal path which results in low thermal dissipation performance.

Because of the absence of a thermal path away from the semiconductor die 24, thermal dissipation in this package is poor.

This package suffers disadvantages, however, as heat must be dissipated form the semiconductor die 24, through the molding compound 28 and then through the heat spreader 32.