LIF socket connector

Abstract

A LIF socket (10) for electrically connecting an IC package and a PCB includes an insulative housing (20) having a supporting surface (202) and a mounting surface (204) opposite to the supporting surface. A number of passages (206) extend from the mounting surface. Each passage has a leading section (208). A number of contacts (30) are disposed in corresponding passages, respectively. Each contact has a planar body (302), a pair of arms (304) extending from two lateral sides of the planar body towards the supporting surface, and a soldering pad (306) angled with respect to the planar body. The arm is formed with a curved contacting (3080) section at a distal end thereof.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a LIF (low insertion force) socket for electrically connecting an IC (integrated circuit) package and a PCB (printed circuit board). [0003] 2. Description of the Prior Art [0004] LIF sockets are widely used in computers, and are generally used for electrically connecting two separate electrical components. Accordingly, data and signal's transmission between the two components is achieved. [0005] A typical LIF socket generally includes an insulative housing and a plurality of contacts disposed in corresponding passages of the housing, respectively. Each contact defines a pair of touching pads for contacting with a corresponding pin of an IC package, and a soldering pad opposite to the touching pad. When the IC package is mounted on the LIF socket and is pressed, each pin contacts the corresponding pair of touching pads of the contact. Accordingly, the IC package is electrically connec...

AI Technical Summary

Benefits of technology

The present invention provides a LIF socket that is convenient for pins of an IC package to be inserted into or taken out of. The LIF socket includes a housing with a supporting surface and a mounting surface opposite to the supporting surface. A number of passages extends from the mounting surface. Each passage has a leading section. A plurality of contacts is disposed in the corresponding passages, respectively. Each contact has a planar body, a pair of arms extending from two lateral sides of the planar body towards the supporting surface, and a soldering pad angled with respect to the planar body. The arm is formed with a curved contacting section at a distal end thereof. The curved contacting section is provided with a smooth curved surface. The elasticity of the spring arms is improved by disposing curved contacting sections on the arms of the contacts to increase an extending length of the arms. The pins of the IC package can easily insert into or withdrawn from the spring arms by disposing smooth curved surface on the contact. The pins of the IC package can rapidly insert into the corresponding arms during assembling by presence of the leading slot and the smooth curved surface on the contact portion of the contact.

Problems solved by technology

However, one problem can be encountered when assembling the IC package onto the LIF socket.

The problem is that only the spring arms of the contact are elastically deformed and the flexibility of the whole contact is not good enough.

Another problem is that each pin of the IC package can not be easily inserted into or withdrawn from the corresponding pair of spring arms because the contact portions of the contact are curve-configured, which raises high resistance.

In addition, if the pins of the IC package offset from a normal position during assembling, the spring arms of the contact will be broken easily because of the interferential force between the pins and the spring arms.

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