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Wafer cassette used in high temperature baking process

Inactive Publication Date: 2007-02-08
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006] According to the description of the prior art, the wafer cassette used in high temperature baking process where the wafer is easy to be collided with the cylindrical stick. Therefore, a resilient sheet is provided to reduce the degree of the collision. The probability to have some damages in the wafer is reduced.

Problems solved by technology

However, during the baking process, the wafer is easy to have some damages in the edge of the wafer or the wafer can be broken when the wafer cassette is in process.
And because the contact area of the cylindrical stick 150 with the wafer is small, it is difficult to enhance the cushion when the cylindrical stick 150 contacts with the wafer and the wafer is easy to have some damages in the edge of the wafer or the wafer will be broken.

Method used

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  • Wafer cassette used in high temperature baking process
  • Wafer cassette used in high temperature baking process
  • Wafer cassette used in high temperature baking process

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Embodiment Construction

[0012] The following is the detailed description of the present invention, which describes the wafer cassette used in high temperature baking process, but the detailed structure composition and the operating theory are not discussed. The portions relating to the conventional techniques are briefly described, and the parts of the drawings are not proportionally drafted. While embodiments are discussed, it is not intended to limit the scope of the present invention. Except expressly restricting the amount of the components, it is appreciated that the quantity of the disclosed components may be greater than that disclosed.

[0013] When the wafer had been tested, it is necessary to put the wafer in the furnace to dry the inks, which are the marks for error chips. However, the wafer would have some damages in the edge of the wafer or the wafer would be broken during the high temperature baking process. The present invention is to provide an improved structure of the wafer cassette in high...

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PUM

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Abstract

A wafer cassette for consolidation in process of high temperature baking is provided. The wafer cassette includes one front end member, two sidewall plates, one back end member, a plurality of fixture slots, two resilient sheets and two supporting rods. By using this wafer cassette in high temperature baking process, the chance of having the wafer damage is minimized.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a wafer cassette. More particularly, the present invention relates to a wafer cassette used in high temperature baking process. DESCRIPTION OF THE PRIOR ART [0002] In the semiconductor fabrication industry, the wafer processing into IC (integrated circuit) chips often includes several steps where the wafers are repeatedly processed, test, stored and transported. Due to the delicate nature of the wafers and their extreme value, it is vital that they are properly protected throughout this procedure. One of the purposes of the wafer cassette is to provide this protection. [0003] In high temperature baking process, a wafer cassette, which is made by metal and can stand heat up to three hundred centigrade degrees, is used. However, during the baking process, the wafer is easy to have some damages in the edge of the wafer or the wafer can be broken when the wafer cassette is in process. [0004] Referring to FIG. 1, it is a pers...

Claims

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Application Information

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IPC IPC(8): A47G19/08
CPCH01L21/6733H01L21/67326
Inventor DAI, JOHNNY
Owner KING YUAN ELECTRONICS