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Electronic component package with EMI shielding

a technology of electromagnetic interference and electronic components, applied in the direction of electrical equipment, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of air space within the shielding lid, not very robust often dislodging, and considerable space occupied by the metal lid of this type on the substrate surfa

Inactive Publication Date: 2008-03-20
HONG KONG APPLIED SCI & TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal lids of this type take up considerable space on the substrate surface and tended to be not very robust often dislodging from the substrate surface due to cyclic stress loading on the solder joints holding the lid to the substrate.
The flow of encapsulating resin is therefore restricted often resulting in air spaces within the shielding lid.
The openings are subsequently blocked by the resin trapping this air within the lid, which is hazardous to package reliability during subsequent thermal excursions and can result in cracking and dislodging of the shielding lid.

Method used

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  • Electronic component package with EMI shielding
  • Electronic component package with EMI shielding

Examples

Experimental program
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first embodiment

[0031]The chip 12 is covered with a plastic resin encapsulant 42 to protect the chip 12 and bonding wire connections 14 using the same dam and fill encapsulation method described above for the To make the package more robust the entire substrate 11 including digital die 40 and the shielding lid 20 is covered in an encapsulating resin 43. The height of the shielding lid 20 and encapsulating resin 43 are controlled so that the top of the shielding lid 20 is not covered in the encapsulating resin 43. A second vent opening 44 is provided in the top 21 of the shielding lid 20 to promote air flow through the shielding space 23 via the two vent openings 30, 44. This substantially reduces the likelihood of moisture accumulation inside the shielding lid 20 during the re-heat process for molding or changes in environmental conditions or subsequent thermal excursions during storage or service of the package 10.

[0032]To make the electronic component packages depicted and described a substrate ...

second embodiment

[0034]For making the package of the second embodiment the shielding lid is provided with a second vent hole in its top 21 prior being located on the substrate. When covering the top of the substrate the height of the mould for the encapsulating resin 43 is controlled so that the top of the shielding lid 20 is not covered in the encapsulating resin 43.

[0035]For high frequency applications the size of the vent openings 30, 44 should typically be less that 3 mm, but may be bigger for lower frequency operations. Electromagnetic waves do not penetrate very far through holes that have a dimension less than their wavelength. Most modern electronic devices such as mobile phones, wireless network adaptors and telecommunications equipment operate in the Ultra High Frequency (UHF) band from 300 MHz to 3 GHz. This is a wavelength range of 1 meter to 100 millimeters.

[0036]The shielding lid 20 may be made of any suitable material for blocking, or at least attenuating, electromagnetic radiation em...

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PUM

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Abstract

An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.

Description

BACKGROUND TO THE INVENTION[0001]1. Field of the Invention[0002]The current invention relates to electronic component packages and to electromagnetic interference (EMI) shielding. More particularly, the invention relates to electronic component packages, such as system-in-package modules, with EMI shielding to isolate a component in the package from electromagnetic interference, or from causing electromagnetic interference, in other parts of the package.[0003]2. Background Information[0004]System-in-package (SiP) technology is an integrated module design that contains one or more IC chips and associated discrete components for performing an entire electronic circuit function incorporated into a single encapsulated package. Electromagnetic interference (EMI), also known as radio frequency interference (RFI), is caused by electromagnetic radiation emitted by electronic circuits and components carrying changing electrical signals. EMI is a major consideration in single package design e...

Claims

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Application Information

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IPC IPC(8): H01L23/02
CPCH01L2224/48091H01L2924/01068H01L2924/01004H01L2924/01078H01L2924/15311H01L2924/16152H01L2924/1815H01L2924/3025H01L2224/48227H01L24/48H01L23/13H01L23/3128H01L23/3135H01L23/552H01L23/564H01L25/16H01L2924/00014H01L2924/14H01L2924/181H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L23/315
Inventor SHAM, MAN-LUNGFU, HUILICHUNG, CHANG-HWA
Owner HONG KONG APPLIED SCI & TECH RES INST