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Heat dissipation device

Inactive Publication Date: 2010-11-18
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the performance of the heat dissipation device is not good, the bridge chip may be overheated and damaged.
However, different bridge chips usually require different heat dissipation devices for increasing heat conduction.
As a result, application of different heat dissipation devices for different bridge chips is costly and time-consuming.

Method used

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Examples

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Embodiment Construction

[0009]Referring to FIG. 1, an exemplary embodiment of a heat dissipation device includes a square plate 10 to be located on a top of an electronic element, such as a bridge chip of a circuit board. Four heat sinks 20 mounted on the plate 10 to absorb heat from the electronic element. A clip 40 made of resilient material to fix the plate 10 on the circuit board, and four fasteners 50, such as four screws, to mount the heat sinks 20 to the plate 10.

[0010]Each heat sink 20 includes a base 21 and a plurality of parallel fins 23 extending perpendicular from the base 21. A fixing hole 212 is defined in a center of the base 21. In one embodiment, the bases 21 of the heat sinks 20 are the same, while heights of the plurality of fins 23 of each heat sink 20 differ. Size of the base 21 and height of the plurality of fins 23 of each heat sink 20 can be predetermined according to need. The number of the heat sinks 20 can be selected according to heat dissipation requirement of the electronic el...

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PUM

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Abstract

A heat dissipation device includes a plate, a protrusion to divide a top of the plate into a number of mounting areas, and a number of heat sinks selectively received on the number of mounting areas.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device for cooling an electronic component of a circuit board.[0003]2. Description of Related Art[0004]Heat dissipation devices are popularly used in electronic devices, such as computers or servers. Usually, a bridge chip in a computer or a server uses a heat dissipation device for increased heat conduction. If the performance of the heat dissipation device is not good, the bridge chip may be overheated and damaged. Therefore, good heat dissipation is critical for the electronic device.[0005]However, different bridge chips usually require different heat dissipation devices for increasing heat conduction. Locations, space, and heat dissipation requirements of the heat dissipation devices for different bridge chips are different. As a result, application of different heat dissipation devices for different bridge chips is costly and time-consuming....

Claims

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Application Information

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IPC IPC(8): F28F13/00
CPCH01L23/367H01L23/4093H01L2924/0002H01L2924/00
Inventor CHEN, MING-KEYE, ZHEN-XING
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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