Wafer side edge cleaning apparatus

Abstract

A wafer side edge cleaning apparatus includes: a cleaning device including a fixing element and a wafer brush disposed beneath the fixing element. The wafer brush is in the shape of a frustum. The frustum has a tapered surface contacting with a side edge of a wafer. The top surface of the frustum is larger than the bottom surface of the frustum. When cleaning the side edge of the wafer, the wafer and the wafer brush are rotated in different directions and a cleaning solution flows out from the fixing element rinses and washes the side edge brush.

Description

BACKGROUND OF THE INVENTION1. Field of the InventionThe present invention relates to a wafer cleaning apparatus, and more particularly, to an apparatus for cleaning the side edge of a wafer.2. Description of the Prior ArtSemiconductor chip fabrication is a complicated process that involves many manufacturing steps. These steps may include layering, patterning, etching, doping, chemical mechanical polishing (CMP), etc. It is well known that, during the various steps in these operations, the surfaces, or side edges of the semiconductor wafers will become contaminated with residues. In particular, the side edge of the wafer may suffer from peelings.The removal of these contaminants and peelings is a priority to semiconductor chip fabricators because contaminants and peelings will pollute the chamber and influence the quality of the integrated circuit on the wafer.Conventionally, one system used to remove wafer contaminants on the surface is a wafer cleaning device. In the wafer cleanin...

AI Technical Summary

Benefits of technology

The present invention provides an apparatus for cleaning the side edge of wafers, including the bevel area. The apparatus includes a wafer stage for holding and rotating the wafer, and a cleaning element consisting of a fixing element and a wafer brush. The wafer brush has a tapered surface that contacts the side edge of the wafer. The tapered surface has a bottom surface and a top surface, with the bottom surface being away from the fixing element and the top surface contacting the fixing element. The tapered surface has a smaller size than the top surface. A cleaning solution rinses the wafer brush when the side edge of the wafer is cleaned by the wafer brush. The apparatus also includes a bolt and a nut for fixing the wafer brush on the fixing element. The technical effect of the invention is that it provides a tool for effectively cleaning the side edge of wafers, particularly the bevel area, which is difficult to reach with conventional cleaning methods.

Problems solved by technology

Semiconductor chip fabrication is a complicated process that involves many manufacturing steps.

It is well known that, during the various steps in these operations, the surfaces, or side edges of the semiconductor wafers will become contaminated with residues.

In particular, the side edge of the wafer may suffer from peelings.

Although a conventional wafer cleaning device can effectively clean the front side of the wafer, such systems fail to provide a cleaning method at the side edge / bevel area to remove contamination and peelings.

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