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Innovative end caps for IC tray

a technology of end caps and ic trays, which is applied in the field of innovative end caps for ic trays, can solve the problems of reducing the service life of the trays, unable to meet the requirement of protecting the precision semiconductor components completely, and damage to the precision semiconductor components, so as to achieve excellent impact resistance and anti-dropping damage ability

Inactive Publication Date: 2013-06-06
UBOT INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a new end cap for IC trays that has great resistance to impact and can prevent damage from dropping.

Problems solved by technology

Due to the limitations of the inherent behavior of plastic materials or structure of the trays, however, the mechanical strength of the trays cannot sometimes meet the requirement of protecting the precision semiconductor components completely from damage during storage and transportation of the precision semiconductor components, especially when IC is enough heavy.
In addition, the tray damage caused by accidental drops will result in the damage of the precision semiconductor components.
Meanwhile, this would also reduce the service lifetime of the trays and bring cost pressures.
Due to the design limitations, however, the traditional end caps can not effectively transfer and disperse the impact stress when the trays with IC are stricken, and cannot completely protect the end caps, trays and the precision semiconductor components from the damages due to accidental drops and collision.

Method used

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  • Innovative end caps for IC tray
  • Innovative end caps for IC tray
  • Innovative end caps for IC tray

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0026]Referring to FIG. 2 and FIG. 3, an innovative end cap for IC trays of the present application is illustrated, which can be used to place, store and transport semiconductors, micro-electronic chips and silicon wafers, and so on. The end cap of this embodiment comprises a bottom 1 and side walls 2 extending upward from the bottom 1, and defines a tray-accommodating space. The end cap of this embodiment comprises a plurality of buffering ribs on touchable surfaces thereof.

[0027]Specifically, the buffering ribs include a plurality of primary buffering ribs 31, secondary buffering ribs 32, and a plurality of tertiary buffering ribs 33. The primary buffering ribs 31 are protruded from the outer surface of the side walls 2, being strip-shaped or curve-shaped. The primary buffering ribs 31 can be parallel to each other or not. Upper edges of the primary buffering ribs 31 can be as high as an upper edge of the corresponding side wall 2, or higher or lower than the upper edge of the cor...

second embodiment

[0033]Compared FIG. 8 with FIG. 1, the end cap with a plurality of buffering ribs and buffering grooves on the side walls, bottom and junctions of the side walls, would not affect the actual volume of the end cap and therefore the innovative end cap can not only be used in the trays with high impact requirements, but also replace the traditional end cap in the normal application areas of trays. The end caps B′ disclosed in the second embodiment are exemplarily installed at opposite sides of the stacked trays A, for being stored and transported together with the stacked trays A. It is can be seen that the end cap of this application is in the same usage for package the trays, but its impact resistance has enhanced greatly.

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Abstract

An innovative end cap for IC trays includes a bottom and side walls. The side walls extend upwardly from the bottom and form a tray-accommodating space. The innovative end cap includes a plurality of buffering ribs and buffering grooves on its surfaces. The buffering ribs and buffering grooves arranged on the end cap can fully absorb, disperse and transfer the impact energy generated during testing, storage, collision and shock of the trays which accommodate the precision semiconductor components therein, and increase impact strength and anti-dropping damage ability of the end cap. Therefore, the innovative end cap with the buffering ribs and buffering grooves can not only protect the trays and extend the service lifetime of the trays, but also give better protection to the precision semiconductor components such as Chips, IC etc in the trays.

Description

TECHNICAL FIELD[0001]The present invention refers to semiconductors and microelectronics technologies, and particularly relates to innovative end caps for IC trays.DESCRIPTION OF BACKGROUND[0002]Currently, plastic IC trays are widely used for the storage and transportation of semiconductor components such as Chip, IC etc in semiconductor and electronic industries. Due to the limitations of the inherent behavior of plastic materials or structure of the trays, however, the mechanical strength of the trays cannot sometimes meet the requirement of protecting the precision semiconductor components completely from damage during storage and transportation of the precision semiconductor components, especially when IC is enough heavy. In addition, the tray damage caused by accidental drops will result in the damage of the precision semiconductor components. Meanwhile, this would also reduce the service lifetime of the trays and bring cost pressures. The innovative end caps for plastic IC tra...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B65D67/00
CPCB65D81/058
Inventor TAM, MING WAWANG, HUIMINJIANG, ZHIGUANG
Owner UBOT INC