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Pattern classification based proximity corrections for reticle fabrication

a proximity correction and pattern technology, applied in the field of patent classification based proximity corrections for reticle fabrication, can solve the problems that conventional circuit design and reticle fabrication techniques do not adequately provide compensation, and achieve the effect of facilitating the correction of proximity effects

Inactive Publication Date: 2016-12-15
GLOBALFOUNDRIES SINGAPORE PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent is about a method for making a circuit design using a reticle. The method includes getting a layout of the circuit design, getting data on the position of the reticle elements when they are formed, and using that data to make corrections to the layout of the circuit design to account for the effects of the reticle formation process. The method also uses these correctors to make changes to the layout that will help the circuit design work better. This technique helps to make better and more reliable circuit designs.

Problems solved by technology

Conventional techniques for circuit design and reticle fabrication do not adequately provide for compensations to be made to a digital layout of a circuit design to account for these undesired variations.

Method used

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  • Pattern classification based proximity corrections for reticle fabrication
  • Pattern classification based proximity corrections for reticle fabrication
  • Pattern classification based proximity corrections for reticle fabrication

Examples

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Embodiment Construction

[0022]As described above, a circuit design after tapeout exists in a digital layout that a mask house uses to manufacture reticle(s) (the term reticle as used herein is understood to encompass ‘mask’ and ‘photomask’ as understood in the art). An example of this manufacturing process, referred to herein as a reticle process, reticle process flow, or reticle-formation process, is depicted and described with reference to FIG. 1.

[0023]The process begins after a Graphic Data System output, GDSout (102) referring to the graphic database system output file / format of the digital layout for the subject circuit design. Various constant global bias adjustments are then determined / performed either separately, or, as depicted here, as part of a single process (104), to adjust for etch or other biases introduced during the reticle formation process. Example bias adjustments include coarse adjustments (ones that are generally applied indiscriminately to all features within a layout or potion there...

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Abstract

Pattern classification based proximity corrections for reticle fabrication are provided. A digital layout of a circuit design and proximity compensation data generated based on measurements of formed reticle elements are obtained. The proximity compensation data includes proximity correction values to correct for proximity effects of a reticle-formation process to form a reticle for use in fabricating a circuit of the circuit design. Based on a pattern classification of one or more patterns in the digital layout of the circuit design, at least one proximity correction is applied to the digital layout of the circuit design to facilitate correcting for proximity effects of the reticle-formation process, the at least one proximity correction being determined based on one or more of the proximity correction values of the obtained proximity compensation data. Additional adjustments to the digital layout are also provided according to aspects described herein.

Description

BACKGROUND[0001]In circuit design, a typical process flow involves a design house producing a digital layout of the design then performing various modifications to the digital layout to bolster the physical and functional aspects of the circuit and adjust for deviations introduced during the fabrication process. Examples modifications include retargeting, dummy feature / via placement, and optical proximity correction (OPC), as examples. At some point, a milestone step known as “tapeout” is reached when the design is considered ready for a mask fabrication process. The design is sent to a mask house (which may or may not be part of the design house) and subjected to a mask data preparation process that itself might include modifications to the design, such as retargeting or bias adjustments, as examples. After that point, reticle(s) for use in printing the design are physically manufactured. A circuit manufacturer uses the reticle(s) to print the circuit design to create the physical ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03F1/36G06F17/50
CPCG06F17/5045G03F1/36G06F30/30
Inventor NING, GUOXIANGLIM, CHIN TEONGACKMANN, PAULBUERGEL, CHRISTIAN
Owner GLOBALFOUNDRIES SINGAPORE PTE LTD