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Electronic device with a fan module

a technology of electronic devices and fan back plates, applied in the direction of cooling/ventilation/heating modifications, electrical equipment, support structure mounting, etc., can solve the problems of increasing the manufacturing cost of the server, affecting the lifespan of the electronic device, and the operation and efficiency of the electronic devi

Active Publication Date: 2016-12-15
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent discusses the issues of electronic devices becoming too hot due to their miniaturization and tight arrangement of components, which can cause instability in their operation and efficiency. To address this, a heat dissipating device is used to effectively dissipate the heat and improve the lifespan of the electronic device.

Problems solved by technology

Due to the high temperature, the operation and the efficiency of the electronic device become unstable, affecting the lifespan of the electronic device.
However, the disposition of the fan back plate may increase the manufacturing cost of the server.
In addition, the space in the server is occupied by the fan back plate, and that makes the volume of the server unable to be reduced.

Method used

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  • Electronic device with a fan module
  • Electronic device with a fan module
  • Electronic device with a fan module

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Experimental program
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Embodiment Construction

[0012]In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

[0013]Please refer to FIG. 1 to FIG. 2. FIG. 1 is a perspective view of an electronic device according to an embodiment of the disclosure. FIG. 2 is an exploded view of the electronic device according to FIG. 1. In this embodiment, an electronic device 10 is, but not limited to, a server. In other embodiments, the electronic device 10 is a desktop. The electronic device 10 includes a case 100, a mother board 200 and a fan module 300.

[0014]The mother board 200 is disposed in the case 100. For example, a central processing unit (CPU), a memory or expansion slots are disposed on the mo...

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PUM

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Abstract

An electronic device includes a case, a mother board disposed on the case and a fan module disposed on the case. The fan module includes a frame, adapters and a transmission assembly. The frame has an air path. The adapters are mounted on the frame. Each adapter includes a first connector and a second connector. The first connector is attached to the frame. The second connector is inserted into the frame and located within the air path. The transmission assembly includes third connectors, a fourth connector, a fifth connector and a cable set, the cable set connected to the third connectors, the fourth connector and the fifth connector. The third connectors are detachably plugged into the first connector. The fourth connector and the fifth connector are plugged into the mother board. Each fan unit has a sixth connector which is plugged into the second connector.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201510311985.4 filed in China, on Jun. 9, 2015, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTIONTechnical Field of the Invention[0002]The disclosure relates to an electronic device, more particularly to an electronic device without a fan back plate.Description of the Related Art[0003]With the development of technology, electronic devices are designed to be lighter, thinner, shorter and smaller, electronic components therein are accordingly miniaturized, and the electronic components are tightly arranged in a case thereof, so that the heat produced from the electronic components is increased as well. Due to the high temperature, the operation and the efficiency of the electronic device become unstable, affecting the lifespan of the electronic device. Hence, a heat dissipating device is adopted t...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/20736H05K7/1492H05K7/1489H05K7/20172
Inventor HUANG, WEN-LONG
Owner INVENTEC PUDONG TECH CORPOARTION