Method for mask and substrate alignment

Abstract

Methods and apparatuses for aligning masks with substrates are provided. A method can include receiving a carrier having a substrate disposed thereon at an alignment stage of an alignment module, transferring a mask from a mask cassette of a mask stocker of the alignment module to a position over the alignment stage, and positioning the mask on the carrier. The method also includes acquiring one or more images of the mask and the substrate, where the mask contains one or more alignment holes passing through the mask and the substrate contains one or more alignment elements disposed on an upper surface of the substrate, analyzing the one or more images to determine one or more differences between one or more alignment holes of the mask and one or more alignment elements of the substrate, and aligning the mask with the substrate based on the differences.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. application Ser. No. 16 / 807,860, filed Mar. 3, 2020, which claims benefit to U.S. Appl. No. 62 / 878,469, filed on Jul. 25, 2019, and U.S. Appl. No. 62 / 852,748, filed on May 24, 2019, which are herein incorporated by reference.BACKGROUNDField[0002]Embodiments of the present disclosure generally relate to fabrication processes and related systems and apparatuses, and in particular to processes for aligning a mask with a substrate and related systems and apparatuses.Description of the Related Art[0003]Generating a semiconductor device typically includes depositing multiple layers of different materials on a substrate (or wafer). In many instances, the layers are deposited through a blanket deposition over the entire substrate. The substrate can then be patterned by a lithography (or similar) process. Further, any extra material can be subsequently removed by an etch process or any other suitable mate...

AI Technical Summary

Benefits of technology

The present invention is related to methods and systems for aligning masks with substrates during the manufacturing process of electronic devices. The technical effect of the patent text is to provide a method for accurately aligning a mask with a substrate by acquiring images of the mask and substrate, analyzing the images to determine differences between the mask and substrate, and positioning the mask on the substrate. The method allows for precise placement of the mask, reducing the likelihood of misalignment and improving the overall manufacturing process. The alignment module includes a mask stocker, transfer robot, and controller, which work together to carry out the alignment process.

Problems solved by technology

However, etching various films, for example organic films, is difficult and time intensive.

Further, the process of depositing one or more layers is time intensive and the patterning processes, such as lithography, are expensive.

For example, using a mask during the deposition process can make expensive process steps, such as lithography and etching, unnecessary.

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