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A back board and method for making same

A manufacturing method and backplane technology, which is applied in the field of backplane manufacturing, can solve problems such as strength limitation, affecting the weight of the whole machine, and failure to achieve it, and achieve the effects of reducing weight, simplifying manufacturing, and improving strength

Inactive Publication Date: 2007-09-19
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The plastic molded backplane is easy to manufacture and low in cost, but its strength is limited during use, and sometimes it cannot achieve the required strength and affects normal use
The back plate formed by metal stamping has high strength and can generally meet the requirements of use, but it is relatively heavy, which will affect the weight of the whole machine, and the cost is relatively high

Method used

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  • A back board and method for making same
  • A back board and method for making same
  • A back board and method for making same

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0012] Referring to Fig. 2 to Fig. 3, the manufacturing method of backplane 1 of the present invention, this backplane manufacturing method comprises the following steps: (1) provide a mold (not shown) with specific structure, the mold cavity of this mold is the shape of backplane 1 ; (2) Place the metal wire 2 cut into several sections in advance together with the plastic in the injection molding machine, and after the injection molding machine heats and melts the plastic, inject it into the cavity for integral molding to form a backplane intermediate product; (3) The four corners of the intermediate product of the backplane are tapped on a drilling machine to form threaded holes, that is, the final product of the backplane with metal wires doped in the plastic raw material is formed.

[0013] The final product material of the backboard 1 is p...

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Abstract

The invention relates to a method of making backing panel which comprises the step of plastic molding which contains steel wires in the plastic electuary. It uses steel wires in the plastic electuary to make backing panel, which brings down the weight of backing panel and enhances the intensity of backing panel.

Description

【Technical field】 [0001] The invention relates to a manufacturing method of a backboard. 【Background technique】 [0002] Due to the high-speed data transmission of the computer and the longer and longer working hours of the computer due to the operation requirements, the heat generated by the central processing unit is increasing accordingly. It is necessary to use a cooling device to dissipate the heat generated when the computer is working. When installing the cooling device on the main board, it must be fixed with the main board with the back plate. At present, there are generally two kinds of backplanes commonly used in the industry, one is a backplane formed by plastic (as shown in Figure 1), and the other is a backplane formed by metal stamping. The plastic-molded backplane is easy to manufacture and has low cost, but its strength is limited during use, and sometimes it cannot achieve the required strength, which affects normal use. The backboard formed by metal stam...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16G06F1/18B29C70/04B29C45/00B29D7/00B29K305/00B29L7/00
Inventor 朱德祥
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU