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Process for continuous liquid processing of photosensitive compositions having reduced levels of residues

A compound, unexposed technology, applied in photosensitive material processing, patterned surface photoengraving process, optics, etc., can solve problems such as difficult to remove, difficult to deal with sludge, and reduced efficiency.

Inactive Publication Date: 2007-11-21
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sludge shortens the period of time the developer can be used without cleaning, thereby reducing efficiency
And sludge can be stubborn and difficult to remove

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] This example illustrates the results of using different photoinitiator systems. Examples 1-1, 1-2 and 1-3, represent the results of the present invention using TCDM-HABI with (or without) benzophenone. Comparative Examples C-1A to C-1C illustrate compositions using o-Cl-HABI with (or without) benzophenone. Comparative Examples C-1D to C-1F illustrate compositions that do not include a HABI photoinitiator.

[0082] Prepare a photosensitive solution with the following composition:

[0083] components

[0084] components

[0085] A solution of 50% solids in acetone was coated to form a film. Individual films were tested for sludge formation and light sensitivity. The results are listed in the table below:

[0086] 1-1

[0087] C-1D

[0088] From the data in the table above it is clear that the sensitivities are all at acceptable levels and that there is much more sludge formation in the compositions using o-Cl-HABI. Compos...

example 2

[0090] This example illustrates the results of using different photoinitiator systems with different binders, Examples 2-1, 2-2 and 2-3 represent examples of the invention using TCDM-HABI. Comparative Examples C-2A to C-2C illustrate compositions using o-Cl-HABI.

[0091] Prepare a photosensitive solution with the following composition:

[0092] components

[0093] A solution of 50% solids in acetone was coated to form a film. The individual membranes were tested for sludge formation and the results are listed in the table below:

[0094] 2-1

[0095] Compositions containing TCDM-HABI again exhibited much less sludge formation. Note that the levels of o-Cl-HABI and TCDM-HABI are chosen to give commercially acceptable photosensitive coatings. In fact, the TCDM-HABI coating has a 25% higher sensitivity than that with o-Cl-HABI.

example 3

[0097] This example illustrates the results of using different photoinitiator systems with different monomers. Example 3-1 represents an example of the invention using TCDM-HABI. Comparative Example C-3A illustrates compositions using o-Cl-HABI.

[0098] Prepare a photosensitive solution with the following composition:

[0099] components

[0100] DEHA

[0101] A solution of 50% solids in acetone was coated to form a film. The individual films were tested for sludge formation and light sensitivity and the results are listed in the table below:

[0102] 3-1

[0103] While such photosensitive compositions generally produced less sludge, it was clearly seen that the TCDM-HABI composition was less sludge than the o-Cl-HABI composition. Because the concentration of HABI is at a very low level, if it is slightly increased, the sensitivity of the TCDM-HABI composition can be improved.

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PUM

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Abstract

Minimization of developed photosensitive compositions is realized through use of a photoinitiator of hexaarylbiimidazole compound having at least one hydrophilic group.

Description

field of invention [0001] This invention relates to processes for developing and stripping aqueous-phase developable photosensitive compositions which produce less residue or sludge. More particularly, it relates to the processing of photosensitive compositions comprising hexaaryldiimidazole photoinitiators. Background of the invention [0002] Photosensitive compositions are well known as photoresists for the manufacture of printed circuit materials, lithographic printing plates and for protection. In such systems, the impact of actinic radiation on the material containing the photoactive component causes physical or chemical changes in the material. The resulting latent image can form a pattern mask or image in subsequent processing. Photosensitive systems can be positive-acting or negative-acting. In positive-working systems, the areas exposed to actinic radiation are removed in post-exposure processing steps, while in negative-working systems, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/42G03F7/30G03F7/031G03F7/029
CPCG03F7/42G03F7/3007G03F7/0295G03F7/30G03F7/033G03F7/0048G03F7/029
Inventor M·R·麦基弗
Owner EI DU PONT DE NEMOURS & CO