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Conductive adhesive composition

A conductive adhesive and solvent technology, applied in electrical components, printed circuits, non-metallic conductors, etc., can solve the problem of not finding conductive adhesives

Inactive Publication Date: 2008-01-23
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, no such conductive adhesive has actually been found so far

Method used

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  • Conductive adhesive composition
  • Conductive adhesive composition
  • Conductive adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0202] A solid conductive adhesive was prepared by using the compound (A) as a diphenylamine derivative and making the compound (A) into a powdery substance (solid substance) with an average particle diameter of 0.4 mm.

Embodiment 2

[0204] Except having used compound (B) instead of compound (A), it carried out similarly to the said Example 1, and prepared the solid conductive adhesive.

Embodiment 3

[0206] Except having used compound (C) instead of compound (A), it carried out similarly to the said Example 1, and prepared the solid conductive adhesive.

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Abstract

The present invention provides a conductive adhesive having excellent electrical conductivity and adhesiveness without using other additives. The conductive adhesive contains a compound expressed by general formula (1) (X1, X2, X3 and X4 are each independently hydrogen atom or a straight-chain alkyl provided that at least one of X1, X2, X3 and X4 is a 3-8C straight-chain alkyl and the others are each hydrogen atom, methyl group or ethyl group; eight R groups are each independently hydrogen atom, methyl group or ethyl group; and Y is a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring.

Description

technical field [0001] The present invention relates to a conductive adhesive. Background technique [0002] In various devices, a conductive adhesive is sometimes used to join members constituting a conductive portion. Generally, a resin binder in which conductive particles such as metal particles and carbon particles are mixed can be used as the conductive adhesive. [0003] In order to electrically connect members using the conductive adhesive, it is generally necessary to bring the members closer to each other by pressing one member toward the other member in a state where the conductive adhesive exists between the members. The above-mentioned members are electrically connected to each other by means of conductive particles in the conductive adhesive. [0004] However, if a mechanically weak member is used as the members to be joined, when one member is pressed against the other, there is a problem that the members themselves cannot withstand the pressing force and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/12
CPCH01B1/12H05K3/321
Inventor 筱原誉筱原祐治寺尾幸一
Owner SEIKO EPSON CORP