Threshold value helium introducing method in metallic film
A metal thin film and thin film technology, which is applied in the field of nuclear energy technology, can solve the problems of uneven distribution, difficulty in distinguishing radiation damage, lattice damage, and large crystal structure damage.
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[0024] Embodiment, introducing hydrogen and helium in the deposited Ti film, in the vacuum sputtering equipment, when the pressure in the vacuum chamber reaches 2×10 -4 Pa, helium (He), hydrogen (H 2 ), helium (Ar) mixed gas, wherein the flow ratio of Ar / He is 42, H 2 The flow ratio of / Ar is 0.05, the total pressure of the mixed gas is 0.95Pa, the discharge voltage and current are 310V and 0.12A, respectively, and the substrate temperature is room temperature, so that hydrogen and helium are co-introduced into the titanium film, and the hydrogen and helium in the film The depth distribution inside is shown in Figure 1.
[0025] In addition to being used in tritium decay simulation research, the invention can also be applied in ion implantation of helium to generate porous layers. For example, Smart-Cut technology in microelectronic materials, and helium pores in semiconductor thin film materials act as effective adsorbents for harmful transition metal impurities, etc.
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