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Exosure method and device

An exposure method and exposure device technology, which are applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problem that the pattern cannot be superimposed on the predetermined position with good precision

Inactive Publication Date: 2008-04-09
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] In this way, when the target correction amount deviates from the actual correction amount, there is a problem that the next pattern cannot be superimposed on the predetermined positional relationship with good accuracy for the pattern already formed on the substrate.

Method used

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  • Exosure method and device
  • Exosure method and device

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Embodiment Construction

[0046] Hereinafter, the exposure method and exposure apparatus of this invention are demonstrated, referring drawings. figure 1 A schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention, figure 2 for figure 1 rough oblique view of .

[0047] exist figure 1 and figure 2 The exposure apparatus EX includes an illumination optical system IL, a mask machine MST, a plurality of projection optical systems PL1-PL5, a substrate machine PST, mask side laser interferometers 39a, 39b, and substrate side laser interferometers 43a, 43b. Among these, illumination optical system IL has several illumination system elements (Module) 10a-10e which illuminate mask M with exposure light. The mask station MST supports the mask M. Several projection optical systems PL1-PL5 are arrange|positioned so that it may correspond to each illumination system element 10a-10e, and project the image of the pattern of the mask M illuminated with exposure lig...

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Abstract

Provide is an exposure method and device, an aligner enabling a precise overlay of patterns in a predetermined positional relation, and an accurate exposure by precisely correcting in performance of a scan exposure, while characteristics of a pattern image are being corrected. In the aligner, a pattern of a mask M is projected on a photosensitive substrate P through a projection optical system PL1-PL5, while synchronously moving the mask M and the photosensitive substrate P. The aligner includes a correction mechanism for correcting a pattern image projected on the substrate P, driving equipment for driving the correction mechanism, and a controller for setting at least either one of a driving speed and amount of driving in the driving equipment in accordance with the speed of a synchronous-movement.

Description

technical field [0001] The present invention relates to an exposure method and an exposure device, in particular to a scanning exposure method and an exposure device for exposing a pattern of the mask to the substrate while moving a mask and a substrate synchronously. Background technique [0002] Electronic components such as liquid crystal display elements or semiconductor elements are manufactured by transferring the pattern formed on the photomask onto the photosensitive substrate, which is called lithography. The exposure device used in this lithographic etching process includes a photomask stage and a substrate stage. The photomask stage carries a photomask with a pattern and moves in two dimensions, and the substrate stage carries a photosensitive stage. The substrate moves in a two-dimensional manner, so that the pattern formed on the photomask moves the photomask machine and the plate machine one by one, and is projected and exposed to the photosensitive substrate t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/22H01L21/027G02F1/13G03F9/00
CPCG03F7/70358G03F9/7019G03F9/7088
Inventor 胜目智弘
Owner NIKON CORP
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