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Packing structure for packing semiconductor assembly

A packaging structure and semiconductor technology, which is applied in the direction of special packaging objects, packaging, transportation and packaging, etc., can solve the problems of not meeting environmental protection benefits, waste of resources, etc.

Inactive Publication Date: 2008-05-21
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the display panels produced have various sizes, various packaging structures must be produced correspondingly
It not only causes waste of resources, is not in line with environmental protection benefits, but also requires a lot of storage space to accommodate packaging materials
The associated costs involved are considerable

Method used

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  • Packing structure for packing semiconductor assembly
  • Packing structure for packing semiconductor assembly
  • Packing structure for packing semiconductor assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Please refer to figure 1 , which shows an exploded perspective view of a packaging structure of the present invention. The packaging structure 100 includes a first container 110 , a second container 160 , a first flexible film 120 , cushioning materials 130 and 150 , and a second flexible film 140 . The combination of the first container 110 and the second container 160 forms an accommodating space, and the first flexible film 120 is placed in the accommodating space. The first container 110 and the second container 160 are made of materials with supporting force and no excessive deformation, such as Styrofoam, hard plastic or metal. The joint portion of the first container 110 and the second container 160 is preferably designed as a nestable structure, so that the first container 110 and the second container 160 can be firmly combined. The first flexible film 120 has a first contact surface 122 , and the plurality of first semiconductor components 10 are placed on th...

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PUM

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Abstract

A package structure for packing at least 2 semiconductor modules in it has a flexible film with a slightly adhesive surface for fixing at least 2 semiconductor modules on it.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a packaging structure for packaging display panels of various sizes. Background technique [0002] With the advancement of display production technology, it has become possible to mass-produce display panels of various sizes. During the transportation of the produced display panels, a large amount of packaging materials are required to ensure that the panels are not damaged. Therefore, the selection of packaging materials and packaging methods occupies a considerable cost in the overall assembly and transportation process. [0003] At present, most of the packaging structures used to package small-sized display panels are made of various plastics, such as polystyrene (polystyrene, PS) or expandable polypropylene (ie, expandable polypropylene, EPP). The accommodating groove is used for accommodating the display panel. However, when the display panels to be produced have vario...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D85/86B65D73/00B65D81/05B65D85/30
Inventor 曾德海黄靖师
Owner AU OPTRONICS CORP