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Substrate transfer apparatus for component mounting machine

A technology for conveying equipment and substrates, applied in the direction of electrical components, electrical components, etc., can solve problems such as defective substrates, no installation, etc., and achieve the effect of low cost

Inactive Publication Date: 2008-07-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the following problem occurs: defective substrates in which components to be mounted are not mounted during the processing of the electronic component mounting machine 1 are produced.

Method used

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  • Substrate transfer apparatus for component mounting machine
  • Substrate transfer apparatus for component mounting machine
  • Substrate transfer apparatus for component mounting machine

Examples

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no. 1 example

[0031] Hereinafter, the first to fifth aspects of the present invention will be described with reference to the first embodiment.

[0032] figure 1 is a perspective view of an electronic component mounting machine as an exemplary component mounting machine according to an embodiment for mounting electronic components, figure 2 is a view of the substrate discharge waiting station 9 in the first embodiment seen from above the substrate discharge waiting station 9 .

[0033] exist figure 1 In , reference numeral 1 denotes an electronic component mounting machine. In this electronic component mounting machine 1, a mounting waiting station 7, a mounting station 8, and a substrate discharge waiting station 9 are provided. Reference numeral 2 indicates a mounted substrate, and reference numeral 2 indicates an unmounted substrate. In the substrate discharge waiting station 9, a substrate arrival detection sensor 5c and a substrate continuous detection sensor 6 are provided.

[0...

Embodiment 2

[0040] The sixth to eighth aspects of the present invention are described with reference to a second embodiment. image 3 is a view of the substrate discharge waiting station 9 in the second embodiment, viewed from above the station 9 . Figures 4A-4C is a view of the substrate discharge waiting station 9 in the second embodiment, viewed from above the station 9, showing the arrangement of the substrate continuous detection sensors 6a, 6b, and 6c in the second embodiment.

[0041] exist image 3 In the present invention, the difference from the first embodiment is that a plurality of substrate continuous detection sensors are provided, and the substrate detection status of the substrate continuous detection sensors located in the positions allowing detection of substrate continuous Dimensions of the substrate in the orientation.

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Abstract

A mounting-waiting process (7) for making a substrate to be transferred into a mounting process (8) wait before the mounting process (8); and a substrate discharge-waiting process (9) for making the substrate transferred from the mounting process (8) wait before the following process are provided. When transfer of an unmounted substrate (3) into the mounting process (8) and transfer of a mounted substrate (2) from the mounting process (8) to the substrate discharge-waiting process (9) are performed simultaneously, it is detected, by a substrate-arrival detecting sensor (5c) for detecting the mounted substrate (2) transferred to the substrate discharge-waiting process (9) and a substrate-continuity detecting sensor (6) for detecting the unmounted substrate (3) continuously transferred following to the mounted substrate (2), that a plurality of substrates have been transferred into the discharge-waiting process (9) continuously.

Description

technical field [0001] The present invention relates to a substrate transfer apparatus for use in a component mounting machine, such as an electronic component mounting machine, for example for transferring a substrate from a mounting waiting station to a mounting station. Background technique [0002] As an apparatus of the above-mentioned type, conventionally, a substrate transfer apparatus for an electronic component mounting machine as shown in FIG. 5 is provided. 5 is a perspective view of an electronic component mounting machine 1 including a conventional substrate transfer device; FIGS. 6A-6D are sequence diagrams showing a substrate transfer process in a conventional substrate transfer device; and FIGS. 7A-7D are A sequence diagram showing a process of simultaneously transferring substrates in a conventional substrate transferring apparatus. In the figures cited above, FIGS. 6A, 6C, 6D, 7A, 7C, and 7D are views of the substrate transfer apparatus viewed from above t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/00H05K13/02
CPCH05K13/0061
Inventor 谷则幸古田昇
Owner PANASONIC CORP
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