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Semiconductor apparatus and cleaning unit thereof

A technology for cleaning units and semiconductors, applied in semiconductor/solid-state device manufacturing, cleaning methods using gas flow, cleaning methods and appliances, etc., can solve problems such as aging and deterioration, containing particles, and contaminating wafer W

Active Publication Date: 2009-02-18
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And because the chemical fluid 18 accumulated on the surface of the pipeline 17 is generally aged and deteriorated or contains particles, when the chemical fluid 18 drops from the surface of the pipeline 17 on the wafer W, the wafer W will be polluted.

Method used

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  • Semiconductor apparatus and cleaning unit thereof
  • Semiconductor apparatus and cleaning unit thereof
  • Semiconductor apparatus and cleaning unit thereof

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Experimental program
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Embodiment Construction

[0030] Figure 2a It is a semiconductor device 100 showing a first embodiment of the present invention, which includes a platform 102 , a fluid supply unit 110 and a cleaning unit 120 . A wafer 101 is supported and rotated by the platform 102 . The fluid supply unit 110 includes a first pipeline 111 , a second pipeline 112 , a third pipeline 113 and a pivoting element 114 . The first pipeline 111 , the second pipeline 112 and the third pipeline 113 are connected to the pivoting element 114 . The cleaning unit 120 includes a cavity 121 , an air inlet 122 , an exhaust outlet 123 and a liquid outlet 125 . The exhaust port 123 is connected to a negative pressure pipeline 124 , and the liquid discharge port 125 is connected to a liquid discharge pipe 126 . The cavity includes an inlet 127 .

[0031] When the first pipeline 111, the second pipeline 112 and the third pipeline 113 are located at a first orientation A1, the first pipeline 111 provides dry nitrogen gas 1111 toward t...

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PUM

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Abstract

The invention provides a semiconductor apparatus and a cleaning unit, and in particular to a semiconductor apparatus for processing a wafer comprising a stage, a fluid supply unit, and a cleaning unit. The stage supports the wafer. The fluid supply unit provides a first fluid, wherein the fluid supply unit is moveable between a second position and a first position. The cleaning unit provides a second fluid, wherein when the fluid supply unit is in the first position, the fluid supply unit provides the first fluid toward the wafer, and when the fluid supply unit is in the second position, the cleaning unit blows the second fluid toward a surface of the fluid supply unit to clean the surface thereof. The invention periodically removes pollutant from the surface of the fluid supply unit. The wafer is, thus prevented from polluted, and reliability of the final product is improved.

Description

technical field [0001] The present invention relates to a cleaning unit, in particular to a cleaning unit for cleaning a fluid supply unit of a semiconductor device. Background technique [0002] Figure 1a It shows a known semiconductor device 1 , including a rotating disk 13 , a pipeline 17 and a nozzle 16 . The nozzle 16 is connected to the pipeline 17 . A wafer W is placed on the rotating disk 13 , and the nozzle 16 and the pipeline 17 provide a chemical fluid to the wafer W. refer to Figure 1b , when the chemical fluid 18 is applied on the wafer W, the rotating disk 13 rotates the wafer W, and the chemical fluid 18 on the surface of the wafer W is splashed by centrifugal force. The splashed chemical fluid 18 adheres to the surface of the pipeline 17 . refer to Figure 1c , as the chemical fluid 18 accumulates on the surface of the pipeline 17 , the chemical fluid (pollutant) 18 will drop on the wafer W. Moreover, since the chemical fluid 18 accumulated on the sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67B08B5/02
CPCH01L21/6708
Inventor 林建坊吕仁智
Owner TAIWAN SEMICON MFG CO LTD