Method for making through-hole and jetting plate of ink-jetting printing head device
A manufacturing method and printing head technology, applied in printing and other directions, can solve problems such as poor inkjet characteristics, long process time, and long process time, so as to reduce chipping or crystal cracks and improve hole positioning Accuracy, effects of improving inkjet characteristics
Inactive Publication Date: 2009-02-25
INT UNITED TECH +1
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Problems solved by technology
However, the traditional sandblasting operation has the disadvantages of too long process time, and because of its large process variation, poor dimensional accuracy, coupled with difficulties in positioning through holes and inkjet due to chipping or crystal cracks Problems such as poor characteristics
Therefore, this way of making through holes will not be conducive to inkjet printing heads with increasing precision
[0005] In addition, it is known that the electroplating method is used to form the nozzles in the nozzle plate. Not only does the process take a long time, but also the nozzles may not be reliably formed due to the absence of the electroplating process.
In addition, it is known that one orifice plate is usually used to bond individual inkjet print head chips separately, so not only does the process take a long time, but also the problem of alignment variation between the chip and the orifice plate often occurs.
Method used
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[0062] Figure 2A ~ Figure 2E It is a schematic cross-sectional view of the manufacturing process of the through hole of the inkjet printing head chip of an inkjet printing head device according to an embodiment of the present invention.
[0063] Please refer to Figure 2A , the present embodiment firstly provides an inkjet printing head chip (printhead) 20, which has a first surface 200a and an opposite second surface 200b, and the thickness of the inkjet printing head chip 20 is, for example, about 200-800 μm (micrometer) or at More than about 400μm. For example, the inkjet printing head chip 20 generally includes a silicon substrate 202 and an isolation structure 204, a dielectric layer 206, an oxide layer ( oxide layer) 208 and a heating device (heating device) 210, wherein the isolation structure 204 is, for example, a field oxide layer; the dielectric layer 206 is, for example, phosphosilicate glass (PSG) or borophosphosilicate glass (borophosphosilicate glass) , BPSG...
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A process for preparing the through hole on the ink-jet printhead chip or jet board includes such steps as providing an ink-jet printhead chip, covering a photosensitive material layer on its first surface, exploding to define a pattern, developing for forming a pattern of photosensitive material, using the pattern as mask, etching to form at least one pit, and forming a through hole in said pit.
Description
technical field [0001] The present invention relates to a method for manufacturing an ink jet printhead device, and in particular to an ink jet print head chip (printhead chip) through hole (through hole) and a nozzle plate ( Nozzle plate) manufacturing method. Background technique [0002] In recent years, driven by the development of high-tech industries, all electronics-related industries have advanced by leaps and bounds. As far as printers are concerned, in just a few years, printing technology has progressed from the early needle-type printing and monochrome laser printing to the current color inkjet printing and color laser printing, and even thermal transfer printing, etc. printing technology. As far as inkjet printers are concerned, the printing technologies used by inkjet printers currently on the market mainly include piezoelectric (piezoelectric) or thermal bubble (thermal bubble) inkjet technology, which is characterized in that ink is sprayed onto The record...
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IPC IPC(8): B41J2/16B41J2/14
Inventor 李致淳郭光哲苏志远高启清胡瑞华蔡尚颖叶世杰
Owner INT UNITED TECH