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Substrate processing apparatus

A substrate processing device and a technology for substrates, which are applied in the fields of photolithography process exposure devices, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as poor substrate processing and abnormal electrical system of the substrate processing device.

Active Publication Date: 2009-09-02
SCREEN SEMICON SOLUTIONS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the substrate processing apparatus of the above-mentioned JP-A-2003-324139, when the exposure apparatus adopting the liquid immersion method described in the above-mentioned International Publication No. 99 / 49504 manual is installed as an external device, the The liquid on the substrate carried out from the exposure device drops into the substrate processing device, and malfunctions such as abnormalities in the electrical system of the substrate processing device may occur
[0008] In addition, the substrate is contaminated by water droplet residues after the exposure treatment and precipitates from the organic film on the substrate, and thus, processing defects of the substrate may occur in subsequent processing steps.

Method used

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no. 1 approach

[0084] (1-1) Structure of substrate processing apparatus

[0085] figure 1 It is a plan view of the substrate processing apparatus according to the first embodiment of the present invention.

[0086] exist figure 1 In each of the following figures, in order to clarify the positional relationship, arrows indicating the X direction, the Y direction, and the Z direction perpendicular to each other are indicated. The X direction and the Y direction are perpendicular to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In addition, in each direction, the direction which the arrow points to is made into a + direction, and the direction opposite to it is made into a 1 direction. In addition, let the rotational direction around the Z direction be the θ direction.

[0087] Such as figure 1 As shown, the substrate processing apparatus 500 includes: an indexer section 9 , an anti-reflection film processing section 10 , a resist film proce...

no. 2 approach

[0210] (2-1) Drying processing unit with 2 fluid nozzles

[0211] The difference between the substrate processing apparatus of the second embodiment and the substrate processing apparatus of the first embodiment is that the drying processing unit DRY employs Figure 13 The 2 fluid nozzles shown are replaced by Figure 4 The nozzle 650 for cleaning treatment and the nozzle 670 for drying treatment. The configuration of other parts of the substrate processing apparatus of the second embodiment is the same as that of the substrate processing apparatus of the first embodiment.

[0212] Figure 13 It is a vertical cross-sectional view showing an example of the internal structure of two fluid nozzles 950 used in washing and drying processes. From the two fluid nozzles 950, gas, liquid, and a mixed fluid of gas and liquid can be selectively injected.

[0213] The two fluid nozzles 950 of this embodiment are called an external mixing type. exist Figure 13 The two fluid nozzles ...

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Abstract

The present invention provides a substrate processing apparatus, which has an indexer area, a processing area for an antireflection film, a processing area for a resist film, a developing processing area, a drying processing area, and an interface area. The exposure device is arranged adjacent to the interface area. The drying treatment area has a drying treatment section. The interface area has a transport mechanism for the interface. After exposing the substrate in the exposure apparatus, the substrate is conveyed to the drying process section by the interface-use conveying mechanism. The substrate is cleaned and dried in the drying treatment section.

Description

technical field [0001] The invention relates to a substrate processing device for processing a substrate. Background technique [0002] Substrate processing equipment is used for various processing of semiconductor substrates, substrates for liquid crystal display devices, substrates for plasma displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and substrates for photomasks. [0003] In such a substrate processing apparatus, generally, a plurality of different processes are continuously performed on one substrate. The substrate processing apparatus described in JP-A-2003-324139 is composed of an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device as an external device that is independent from the substrate processing device is disposed adjacent to the interface area. [0004] In the above-mentioned substrat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027G03F7/26
Inventor 安田周一金冈雅金山幸司宫城聪茂森和士浅野彻鸟山幸夫田口隆志三桥毅奥村刚
Owner SCREEN SEMICON SOLUTIONS CO LTD