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Single package containing multiple integrated circuit devices

A technology for integrated circuits and packages, applied in the field of improved ball grid array packages, can solve problems such as small space requirements and obstacles, and achieve the effect of small carrier space

Inactive Publication Date: 2009-10-14
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, barriers related to space requirements between the various internal IC devices for maintaining a small footprint

Method used

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  • Single package containing multiple integrated circuit devices
  • Single package containing multiple integrated circuit devices
  • Single package containing multiple integrated circuit devices

Examples

Experimental program
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Embodiment Construction

[0027] Figure 1A It is a configuration diagram of two IC devices 2 and 4 in a ball grid array (BGA) package 10 in one embodiment of the present invention. These devices are mounted on the same package substrate within package 10 and are electrically isolated from each other. In this configuration example, device 2 can be an L41 chip, which is a 1394a link layer controller with copyright protection; device 4 can be a P23 chip, which is a 1394a physical layer controller with two interfaces. Both chips, L41 and P23, are available from PHILIPS Semiconductor, Sun Valley, CA.

[0028] In accordance with the present invention, each IC device should be mounted on the packaging substrate in an orientation such that the isolated areas of the electrical connections of the IC devices are within specified areas. For example, two IC devices can be placed in such Figure 1A Two different sections are shown; three IC devices should be placed in three different sections, and so on. In addit...

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PUM

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Abstract

The present invention allows multiple integrated circuit devices to be mounted on the same substrate within a single ball grid array package. The present invention requires a minimum distance between the electrical connections of the integrated circuit devices to maintain electrical isolation so that the devices can operate at different voltage differentials. Signals from each device can be connected to each other from outside the package using galvanic isolation techniques. The present invention provides the user with the flexibility of choosing whether to use isolation between devices, and takes up less PC board space because only one package is used on the board.

Description

technical field [0001] The present invention relates generally to semiconductor integrated circuit (IC) packages, and more particularly to an improved ball grid array (BGA) package comprising a plurality of electrically insulated IC devices. Background technique [0002] Conventionally, IC devices are mounted on a printed circuit board (PC board), and the IC devices on the board are kept electrically isolated. To efficiently utilize space on a PC board, there are many packages that contain multiple IC devices, commonly referred to as multi-chip modules (MCMs). These devices are interconnected within the package and have a common power and ground level. There are also simple packages where two IC devices are kept electrically isolated within a single package. IC devices in such simple packages are limited to simple transceivers and DC (direct current) to DC converters, and such packages are limited to DIP (dual in-line package, dual in package), SOJ (J small outline J lea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L23/538H01L25/10H01L25/18H05K1/14H05K3/34
CPCH01L25/0655H01L2924/15311H05K3/3436H01L2224/16225H05K1/141H01L23/5386H01L23/48
Inventor J·W·达文波尔特R·R·帕克J·E·康德
Owner TAIWAN SEMICON MFG CO LTD