Active energy ray-curable resin composition and method for forming resist pattern
A technology of resin composition and activation energy, which is applied in the photoplate making process of patterned surface, semiconductor/solid-state device manufacturing, and photosensitive materials used in optomechanical equipment, etc., which can solve the problem of poor resolution of resist pattern and cost Increased height, increased etching burden, etc., to achieve significant effects and prevent vignetting
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Synthetic example 1
[0059]
[0060]Acrylic resin (resin acid value 600mgKOH / g, styrene / acrylic acid = 20 / 80 weight ratio) was reacted with 125 parts of glycidyl methacrylate to obtain resin 1 (resin solid content 55% by weight, propylene glycol monomethyl ether organic Solvent, resin acid value 55mgKOH / g, weight average molecular weight is about 50,000).
Synthetic example 2
[0061]
[0062] 199 parts of triphenolmethane type epoxy resin with epoxy equivalent of 205 (g / eq) were dissolved in 370 parts of epichlorohydrin. Then, tetramethylammonium chloride was added, and an aqueous NaOH solution was further added dropwise to react at 70°C for 3 hours. After the reaction was completed, it was washed with water, and epichlorohydrin was distilled off under reduced pressure. Furthermore, the reaction product was dissolved in methyl isobutyl ketone, NaOH aqueous solution was added, and the reaction was carried out at 70° C. for 1 hour. After completion of the reaction, it was washed with water, and then methyl isobutyl ketone was distilled off to obtain 195 parts of epoxy resin (a) having an epoxy equivalent of 189 (g / eq).
[0063] 189 parts of epoxy resin (a) was dissolved in 68.5 parts of acrylic acid and carbitol acetate. Then, the reaction was carried out at 95°C in the presence of Mitokine and triphenylphosphine. When it is confirmed that the acid value...
Synthetic example 3
[0064]
[0065] 240 parts of cresol novolak type epoxy resin having an epoxy equivalent of 199 (g / eq) were dissolved in 370 parts of epichlorohydrin and dimethyl sulfoxide. Then, NaOH was added and reacted at 70°C for 3 hours. Then, unreacted epichlorohydrin and dimethyl sulfoxide were distilled off under reduced pressure, and the reaction product was further dissolved in methyl isobutyl ketone. Then, an aqueous NaOH solution was added, and the reaction was carried out at 70°C for 1 hour. After completion of the reaction, it was washed with water, and then methyl isobutyl ketone was distilled off to obtain 241 parts of epoxy resin (b) having an epoxy equivalent of 190 (g / eq).
[0066] Dissolve 190 parts of epoxy resin (b) in 68.5 parts of acrylic acid and carbitol acetate. Then, it was reacted at 95°C in the presence of mitol-hydroquinone and triphenylphosphine. When it is confirmed that the acid value is 1.0 (mgKOH / g) or less, 121.6 parts of hexahydrophthalic anhydride and carbi...
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