A method for model based geometry decomposition for use in a multiple exposure process and corresponding product

A technology of multiple exposures and single exposures, which is applied in microlithography exposure equipment, photolithography exposure devices, special data processing applications, etc., can solve the problems that the algorithm cannot find the result, cannot obtain k, etc.

Inactive Publication Date: 2007-08-01
ASML NETHERLANDS BV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, for some target patterns, it is not possible to obtain k 1 <0.25
[0012] Another problem associated with current decomposition algorithms is that these algorithms are primarily rule-based algorithms that require a large nu...

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  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product
  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product
  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product

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Embodiment Construction

[0038] As explained in more detail below, the model-based shading process breaks down the target pattern into segments that are independently illuminated during multiple exposures. In one embodiment, multiple segments are allocated and included in one of two separate reticles that are subsequently illuminated. Furthermore, as shown in the examples disclosed herein, the model-based shading process automatically provides, when necessary, to decompose individual geometric structures (ie, features) in the target pattern into Image multiple segments.

[0039] Referring to FIG. 1, which is an exemplary flowchart of a model-based rendering process, the first step in the process (step 10) is to define the target pattern (i.e., the pattern to be imaged on the substrate) and the pattern that will be used to Illumination setup for imaging the target pattern. The target pattern is preferably described in a data format, such as "gds", which is a standard data format. However, any other ...

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Abstract

A method of decomposing a target pattern having features to be imaged on a substrate so as to allow said features to be imaged in a multi-exposure process. The method includes the steps of: (a) segmenting a plurality of the features into a plurality of polygons; (b) determining the image log slope (ILS) value for each of the plurality of polygons; (c) determining the polygon having the minimum ILS value, and defining a mask containing the polygon; (d) convolving the mask defmed in step (c) with an eigen function of a transmission cross coefficient so as to generate an interference map, where the transmission cross coefficient defines the illumination system to be utilized to image the target pattern; and (e) assigning a phase to the polygon based on the value of the interference map at a location corresponding to the polygon, where the phase defines which exposure in said multi-exposure process the polygon is assigned.

Description

technical field [0001] The technical field of the invention relates generally to a method, program product, and apparatus for performing model-based decomposition on a target pattern to allow the target pattern to be imaged, eg, with multiple masks in multiple illumination passes. Background technique [0002] This application claims the benefit of U.S. Patent Application Serial No. 60 / 754,312, filed December 29, 2005, and U.S. Patent Application Serial No. 60 / 776,199, filed February 24, 2006, Both patent applications are hereby incorporated by reference in their entirety. [0003] A lithographic apparatus may, for example, be used in the manufacture of integrated circuits (ICs). In this case, the mask may contain a circuit pattern corresponding to the individual layers of the IC, and this pattern may be imaged onto a substrate (silicon wafer) that has been coated with a layer of radiation-sensitive material (resist) ( For example, on a target portion comprising one or mor...

Claims

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Application Information

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IPC IPC(8): G03F7/20G06F17/00H01L21/027
Inventor R·J·索查
Owner ASML NETHERLANDS BV
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