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Process for manufacturing optical and semiconductor elements

一种半导体、元件的技术，应用在成形元件的阵列领域

Inactive Publication Date: 2007-12-12
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, individually ground shaped elements must be handled individually, which is difficult

Method used

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  • Process for manufacturing optical and semiconductor elements
  • Process for manufacturing optical and semiconductor elements
  • Process for manufacturing optical and semiconductor elements

Examples

Experimental program
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Embodiment Construction

[0012] Figures 1a and 1b illustrate representative embodiments of patterned abrasives 10, 30 for abrading a substrate material to form an array of individual optical and / or semiconductor elements. Grinding, as used herein, can include simultaneously grinding and polishing a substrate material, however, polishing can also be performed as a separate step. In addition, "separate" and "singulated" as used herein with respect to an element or shaped element means that the element is an identifiable unit, but not necessarily separated from other elements. Likewise, "singulating" refers to the formation of identifiable units, which need not necessarily be separated from each other. As shown, the patterned abrasive 10 , 30 includes a working surface 12 , 32 and a backing 14 , 34 . The working surface 12 , 32 includes protrusions 16 , 36 , particles 18 , 38 and binder 20 , 40 .

[0013] The patterned abrasive 10,30 is formed by applying to a backing 14,34 a composition of particles 1...

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PUM

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Abstract

A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.

Description

technical field [0001] The invention relates to a method for manufacturing arrays of shaped elements, such as optical elements and semiconductor elements. Background technique [0002] Optical elements (i.e., shaped bodies of inorganic or organic material with facets along at least one plane that reflect, refract and absorb light and / or heat conduction) and semiconductor components. These methods include: moulding; grinding individual elements; casting optics from sol-gel followed by sintering; microreplication; and methods using surface tension or shrinkage to form desired shapes. Of these methods, only grinding can produce precise shapes from refractory or crystalline materials. However, lapping is one of the slowest and most expensive methods for fabricating large quantities of optical components, especially for ceramics with high thermal conductivity such as diamond, silicon carbide, and sapphire. In addition, individually ground shaped elements have to be handled i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B13/015B24B19/03G02B3/00H01L33/20H01L33/58
CPCH01L2924/0002B24D18/0009H01L33/58H01L33/20H01L2924/00B24B13/015B24B19/03G02B3/00
Inventor 安德鲁·J·欧德科克保罗·S·勒格奥勒斯特尔·小本森凯瑟琳·A·莱瑟达尔威廉·D·约瑟夫
Owner 3M INNOVATIVE PROPERTIES CO