IC socket and manufacturing method for the same
A socket and contact piece technology, used in the manufacture of contact boxes/bases, coupling devices, discharge tubes, etc., can solve problems such as increased heat generation or voltage drop
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no. 1 example
[0051] figure 1 and figure 2 The IC socket of this embodiment is shown. it's here, figure 1 is the plan view of the main part of the IC socket, figure 2 is along figure 1 A cross-sectional view of line A-A.
[0052] The IC socket 1 of this embodiment is mainly composed of a substantially plate-shaped socket base body 10 integrally formed with synthetic resin and a plating layer 20 provided at a desired position on the socket base body 10 .
[0053] A plurality of through holes 11 serving as contact housing holes are formed in a predetermined layout on the socket base body 10 . In this embodiment, each through-hole 11 in planar shape is formed in a rectangle.
[0054] Meanwhile, a columnar through hole forming portion 12 protruding toward an unillustrated IC package is formed near one peripheral portion in the longitudinal direction of each through hole 11 on the socket base body 10 . Such as figure 1 and figure 2 As shown, the through-hole forming portion 12 is for...
no. 2 example
[0095] Figure 10 and Figure 11 An IC socket 2 according to a second embodiment of the present invention is shown. Figure 10 is the plan view of the main part of the IC socket, Figure 11 is along Figure 10 Cross-sectional view of line B-B in.
[0096] The IC socket 2 of this embodiment is configured to add an elastic body 60 described later to the IC socket 1 according to the first embodiment. Other features of the IC socket 2 are similar to those of the first embodiment. Therefore, with regard to the IC socket 2, the same components as those in the first embodiment are designated by the same reference numerals and detailed description will be omitted here.
[0097] Such as Figure 10 and Figure 11 As shown, an elastic body 60 representing a material having elasticity (elastic energy) is provided in the through hole 11 of the IC socket 2 of this embodiment, and it is used to adjust the contact pressure of the contact piece 14 and to suppress contact with the contac...
no. 3 example
[0100] Figure 12 and Figure 13 An IC socket according to the third embodiment is shown. it's here, Figure 12 is a plan view of main parts of the IC socket according to the third embodiment, Figure 13 is along Figure 12 A cross-sectional view of line A-A.
[0101] The IC socket 101 of this embodiment is mainly composed of a plurality of contact pieces 110, a socket base body 120 for arranging these contact pieces 110 in a predetermined structure, and a through-hole portion 130.
[0102] Each contact piece 110 is formed by forming a conductive and elastic (elastic energy) metal plate made of, for example, a copper alloy such as beryllium copper or phosphor bronze, a stainless steel alloy. The contact piece 110 is formed in a rectangular shape, and an opening 111 for communicating with a through hole 131 to be described later is formed on a first end thereof.
[0103] Such as Figure 13 As shown, on the second end of the contact pad 110 is formed a contact protrusion ...
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