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Photosensitive resin composition for forming light shielding layer, light shielding layer and color filter

A technology of photosensitive resin and light-shielding layer, which can be used in optical filters, photosensitive materials for optical mechanical equipment, optics, etc., and can solve problems such as poor curing, low sensitivity, and insufficient exposure light transmission.

Active Publication Date: 2011-07-20
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, if a thick-film black matrix is ​​formed using a photoresist composition containing a general black pigment, the transmission of exposure light in the exposure process becomes insufficient, and exposure defects that become non-uniform tend to occur.
That is, there is a problem that it is difficult to form a black matrix with a thick film well due to poor curing due to low sensitivity.

Method used

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  • Photosensitive resin composition for forming light shielding layer, light shielding layer and color filter
  • Photosensitive resin composition for forming light shielding layer, light shielding layer and color filter
  • Photosensitive resin composition for forming light shielding layer, light shielding layer and color filter

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0126] According to JP-A-2001-354735, add 235g of bisphenol olefin type epoxy resin (235 epoxy equivalent) and 110mg of tetramethylammonium chloride, 2,6-di-tert-butyl-4-methyl 100 mg of base phenol and 72.0 g of acrylic acid were blown into them with air at a rate of 25 mL / min, while heating at 90 to 100° C. to dissolve.

[0127] Next, while the solution was in a cloudy state, the temperature was slowly raised, and it was heated to 120° C. to completely dissolve it. The solution gradually became transparent and viscous, but continued to stir.

[0128] During this time, the acid value was measured, and stirring was continued until it became less than 1.0 mgKOH / g. It takes 12 hours for the acid value to reach the target. Then, it cooled to room temperature, and the bisphenol olefin type epoxy acrylate represented by the following chemical formula (3) of a colorless transparent solid state was obtained.

[0129] [chemical 13]

[0130]

[0131] Next, 600 g of propylene gly...

Embodiment 1

[0134] Each component was mixed in the following formulation, and the photosensitive resin composition for light-shielding layer formation was prepared.

[0135] As the (B) alkali-soluble resin, 100 parts by mass of Compound 1 obtained in Synthesis Example 1 above was used.

[0136] As (C)component, 50 mass parts of dipentaerythritol tetraacrylates were used.

[0137] As (A) a light-shielding dye, 30 parts by mass of a perylene-based black pigment dispersion (C.I. Pigment Black 31: 15%, dispersant 10%, solvent: PGMEA) was used.

[0138] As (D) photopolymerization initiator, 30 parts by mass of CIBASPECIALTY CHEMICALS product name: Irgacure 369, compound name: 2-benzyl-2-dimethylamino-1-(4- Morpholinophenyl)-butane-1-one.

[0139] As (E) organic solvent, the mixed solvent whose mass ratio PGMEA:3-methoxybutyl acetate is 1:3 was used. The usage-amount of the organic solvent was adjusted so that the solid content concentration might become 30 mass %.

[0140] The photosensiti...

Embodiment 2

[0147] In the compounding of Example 1, instead of 30 parts by mass of the perylene-based pigment dispersion, 40 parts by mass were used to mix the perylene pigment dispersion and the carbon black dispersion "CF" at a ratio of 90:10. The pigment mixture obtained from Black EX-1455" was used to prepare a photosensitive resin composition for forming a light-shielding layer.

[0148] Using the photosensitive resin composition for forming a light-shielding layer obtained, it was carried out in the same manner as in Example 1 to form a coating film at 30 mJ / cm 2 exposure. After the exposure, it was developed by spraying for 60 seconds with a potassium hydroxide 0.04% developing solution. Furthermore, post-baking was performed at 200 degreeC for 30 minutes, and the black matrix of the matrix pattern of 20 micrometers with a film thickness of 3 micrometers, a dot pattern, and an isolated pattern was formed. The OD value of the formed black matrix was 4.5.

[0149] The shape of the...

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Abstract

A photosensitive resin composition for forming a light shielding layer is a photosensitive resin composition for forming a light shielding layer with a film thickness of more than 2 m, comprising (A) a light shielding pigment, (B) an alkali soluble resin, (C) a photopolymerizable compound and (D) a photopolymerization initiator, and is characterized in that the (A) light shielding pigment comprises a perylene black pigment.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for forming a light-shielding layer, and a light-shielding layer and a color filter formed using the composition. [0002] Based on Japanese Patent Application No. 2005-048507 filed on February 24, 2005, the present invention claims priority to it, and its content is cited here. Background technique [0003] For example, in a color filter used in a color display device, pixels composed of red (R), green (G), and blue (B) usually have a structure surrounded by a grid-like black light-shielding layer called a black matrix. . [0004] As one of the manufacturing methods of such a color filter, a method of forming a colored layer of a color filter by an inkjet method using a black matrix as a partition wall has been proposed (for example, Patent Document 1 below). [0005] In addition, in various display devices not limited to color filters, it is also possible to improve the contrast of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G02B5/20
CPCG02B5/223G03F7/105G03F7/0007
Inventor 大西启之丸山健治内河喜代司
Owner TOKYO OHKA KOGYO CO LTD
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