Semiconductor chip packaging structure

Abstract

A package structure for the semiconductor chip is provided, which is to set the inner conductor in the center pylome of the outer conductor jutting from one end of the outer conductor, wherein taking the insulated barrier as the isolation, attach a plurality of semiconductor chip onto the adjoining position of the outer conductor and inner conductor which is favorable to connect the semiconductor chip onto the inner conductor and outer conductor as the current electrode in series, parallel or series-parallel connection. Besides, set the light source used in the package structure of the semiconductor chip into the shell with spot light cup to form a semiconductor light source device with functions of both light gathering and radiating.

Description

technical field [0001] The invention relates to a semiconductor chip packaging structure, and in particular to a semiconductor chip packaging structure with both light concentrating and heat dissipation and an application device thereof. Background technique [0002] The application of known semiconductor chips such as light-emitting diodes (LEDs) must be packaged in a packaging structure and lead out electrodes, so as to facilitate users to connect power supply to make them work or emit light. [0003] For a single low-power LED, heat dissipation is not the main consideration of the packaging structure. Recently, in order to increase the application range of LEDs, multi-chip, high-power LED packaging has become an inevitable trend requirement. For example, U.S. Patent No. 6,492,725 titled "Concentrically Leaded Power Semiconductor Device Package" proposes a concentric package structure to facilitate the heat dissipation of a structure packaged with multiple high-power chip...

AI Technical Summary

Problems solved by technology

Although this kind of package structure can solve the heat dissipation problem of packaging multiple high-power chips, because only one side of the package structure can be attached to the semiconductor chip, the number of packages of the semiconductor chip is limited, and when the semiconductor chip is In the case of light-emitting diodes, because the semiconductor chips distributed around the package structure cannot be concentrated, it is difficult to meet the light-gathering requirements when applied to semiconductor light source devices.

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