A method of manufacturing a shielding cover and a shielding cover manufactured by the method
A manufacturing method and shielding cover technology, applied in shielding, magnetic field/electric field shielding, instrument parts, etc., can solve problems such as difficult manufacturing, difficult to ensure accuracy, difficult to determine the position for accurate spraying, etc., to reduce production costs and facilitate The effect of wiring
Inactive Publication Date: 2011-11-30
YINGHUADA (SHANGHAI) ELECTRONIC CO LTD
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Problems solved by technology
If the conductive medium is directly sprayed on this part, it is difficult to determine the position for accurate spraying; if the structure of this part is made of metal materials alone and manufactured by cold punching process, the structure is more complicated and difficult to manufacture, and the shielding cover 1 and the black mark When the components made in part 2 are welded on the circuit board 4 respectively, it is difficult to ensure that the precision of the two is exactly matched, and it is easy to produce a distance deviation, which affects the welding quality, so that there is a gap between the shielding cover 1 and the circuit board 4, and the shielding effect is reduced; if It is more difficult to manufacture the shielding cover 1 and the structure shown in the black marked part 2 directly at the same time
As mentioned above, figure 1 The layout shown prevents electronics engineers from implementing
Method used
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[0035] to solve figure 1 In the shown shielding cover 1, the structure shown in the black mark part 2 needs to be grounded to isolate the electronic module. The present invention adopts the following Figure 2 to Figure 7 The method and structure shown.
[0036] refer to Figure 2 to Figure 7 , the shielding cover of the present invention is fixed on a circuit board 4, and the shielding cover includes a shielding frame 3 and a shielding frame cover 6, and a shielding spacer strip 5 is used to fix the shielding frame 3 and the shielding frame cover 6 respectively, and in the shielding Conductive medium is sprayed on the isolation bar 5 to help realize grounding.
[0037] The manufacturing method of the shielding cover of the present invention is as follows: two ribs 31 used for the SMT suction nozzle in the shielding frame 3 are cut off, and the shielding frame 3 is directly fixed on the circuit board 4 by SMT. Using a shielding spacer 5, after spraying conductive medium on ...
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The invention provides a method for manufacturing a shielding cover. The shielding cover is fixed on a circuit board, including a shielding frame and a shielding frame cover. Spray conductive media. The present invention also provides a shielding cover manufactured by the above method. The shielding isolation bar provided by the invention can effectively solve the problem that there is another grounding part in the shielding cover to isolate the electronic module, and at the same time ensure the shielding effect of the shielding cover and facilitate the layout of the electronic engineer on the circuit board.
Description
technical field [0001] The invention relates to a manufacturing method of a shielding cover, in particular to a manufacturing method of a shielding cover applied on a circuit board; the invention also relates to a shielding cover adopting the manufacturing method. Background technique [0002] The rapid development of the electronics industry has led to more and more applications of electronic products, especially high-precision electronic products. Where there are radio frequency circuits, there are usually shielding cases to prevent electromagnetic interference (EMI, Electro Magnetic Interference), Shield the components that are easy to cause interference to the outside world to prevent them from causing interference to the outside world, or shield the components that are easy to receive external interference to prevent the absorption of external interference. [0003] The shielding cover is usually divided into fixed type (SMT directly soldered to the grounding part of th...
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IPC IPC(8): H05K9/00G12B17/02
Inventor 林世寅马震宇
Owner YINGHUADA (SHANGHAI) ELECTRONIC CO LTD