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Multiple mounting head with collective rotary drive and adjustable lifting device for component holding devices

A technology of electronic components and assembly heads, applied in the direction of electrical components, electrical components, etc., can solve the problems of reduced assembly efficiency and achieve the effect of improving flexibility

Active Publication Date: 2011-09-21
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the use of a drive technology that is applied in its entirety to several holding devices has the disadvantage that at least one specific assembly sequence must be observed when mounting the received components on the substrate to be assembled, without a significant reduction in assembly efficiency
This reduction in assembly efficiency can be caused, for example in a rotary assembly head, by multiple back and forth rotations of the holding device which is star-shaped mounted on the rotor of the assembly head
This will lead to, especially when several different types of components are to be mounted on the substrate, the assembly head may have to travel through additional travel paths, so that the components are respectively mounted in the correct positions corresponding to the predetermined assembly sequence

Method used

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  • Multiple mounting head with collective rotary drive and adjustable lifting device for component holding devices
  • Multiple mounting head with collective rotary drive and adjustable lifting device for component holding devices
  • Multiple mounting head with collective rotary drive and adjustable lifting device for component holding devices

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Embodiment Construction

[0037] It should be noted here that the reference designations of identical or mutually corresponding elements in the figures differ only in their first numerals.

[0038] figure 1 A mounting device 100 is shown which has a frame 102 on which two parallel-pointing guides 103 are arranged. Two guides 103 carry a transverse support arm 104 . The transverse support arm 104 itself has a guide 105 on which a support part 106 is movably arranged. The two guides 103 run in the y-direction and the guides 105 run in the x-direction. Arranged on the carrier part 106 is a mounting head 150 which has two holding devices 180 .

[0039] The two holding devices 180 are fastened to a rotor (not shown) of the multi-head assembly head 150, which is rotatable about the rotor axis of rotation. The axis of rotation of the rotor is positioned parallel to the z-direction, which is perpendicular to the x-direction and the y-direction. The corresponding rotational movement of the holding device 1...

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PUM

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Abstract

An assembly head (250) for assembling elements for a substrate is disclosed, comprising: a stator (260), a rotor (270) which rotates by surrounding a rotor rotation axial line (275) opposite to the stator (260); at least two element holding devices (280) which is equipped on the rotor (270) with being vertical to a plane of the rotor rotation axial line (275). The plurality of holding devices (280) rotates opposite to a parallel rotation axial line (282) of the rotor (270); moving direction (285b) of the parallel rotation axial line (282) is arranged movably. The assembly head (250) comprises: a rotation actuator (285) which is connected with the holding devices (280), the holding devices surrounds the rotation axial line (282) of the rotation actuator for rotation when the rotation actuator (285) starts up; a lifting actuator (290) which surrounds the rotor rotation axial line (275) to be rotatably arranged opposite to the rotor (270), rotation along with the selected holding device (280) is individually supplies, which can be independently connected with the selected holding device (280) and give rise to the lifting movement of the selected holding device (280) in the moving direction (285b).

Description

technical field [0001] The invention relates to an assembly head, an assembly device and a method for assembling electronic components for a substrate. Background technique [0002] During the automatic assembly of substrates and component carriers by so-called automatic assembly systems, the components are delivered by a component feed to defined pick-up positions and picked up there by an assembly head which can be positioned in the working area by means of a positioning system. The picked components are transported by the assembly head to the assembly position and mounted on the substrate to be assembled in the mounting position defined by the corresponding connection plane. [0003] In order to achieve the highest possible assembly efficiency, so-called multi-head assembly heads were developed. The term assembly efficiency is understood in this context to mean that within a predetermined time unit (for example one hour) a large number of components can be mounted with t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0413H05K13/0452H05K13/0406H05K13/041
Inventor 罗伯特·劳赫
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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