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Resin sealing apparatus, movable member and resin sealing method

A technology of moving parts and resins, applied in semiconductor/solid-state device manufacturing, electrical components, household components, etc., can solve problems such as hindering the work of the plunger, and achieve the effect of reducing the amount of resin

Inactive Publication Date: 2013-05-22
DAIICHI SEIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, long-term use will cause the residual resin in the flow channel to adhere to the side of the plunger, which may hinder the smooth operation of the plunger

Method used

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  • Resin sealing apparatus, movable member and resin sealing method
  • Resin sealing apparatus, movable member and resin sealing method
  • Resin sealing apparatus, movable member and resin sealing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0160] figure 1 A resin sealing device having the plunger plate 60 having the structure according to the first embodiment is shown. This resin sealing device has a lower mold assembly 1 and an upper mold assembly 2 .

[0161] (1 lower metal mold assembly 1)

[0162] Such as figure 2 with image 3 As shown, the structure of the lower metal mold assembly 1 is roughly as follows: the cylinder block 4, the lower mold frame plate 5 and the lower mold support 6 are sequentially stacked on the slide plate 3, and the lower mold cavity block 7 is arranged on the lower mold support 6. .

[0163] Such as figure 1 As shown, the lower mold assembly 1 can move between the lower position and the side position of the upper mold assembly 2 by reciprocatingly mounting the slide plate 3 on the bottom plate 9 provided on the stand 8 . That is, the guide rail 10 is provided on the upper surface of the bottom plate 9, and the slide plate 3 is arrange|positioned on this guide rail 10 so that ...

Embodiment approach 2

[0218] Figure 19 An example of the push plate 80 according to Embodiment 2 is shown. In this push plate 80, the groove portion 81 formed on the resin supply surface P1 is composed of a first concave portion 81a and a second concave portion 81b, and the first concave portion 81a is formed at a distance from the moving region E1 shorter than the dimension X2 in the first embodiment. The second concave portion 81b is formed at a position separated by a predetermined dimension X4 from the first concave portion 81a at a position of a predetermined dimension X3. The recesses are formed on both sides of the moving region E1, respectively. And the 2nd recessed part 81b is continuous with the continuous groove part on the remaining 3 side surfaces. In addition, the grooves 81 are arranged in parallel at three locations in the lifting direction of the push plate 80 , and the dimension Y3 in the direction of the parallel arrangement is shorter than the dimension Y1 as in the first emb...

Embodiment approach 3

[0223] Figure 20 An example of the push plate 90 according to Embodiment 3 is shown. In this push plate 90, the groove part 91 formed in the resin supply surface P1 is comprised by the 1st recessed part 91a, the 2nd recessed part 91b, and the 3rd recessed part 91c. Regions formed between the moving region E1 and the first recess 91a, between the recesses 91a and 91b, and between 91b and 91c ( Figure 20 The flat portion of the portion indicated by the middle dimensions X3 and X4) is arranged in a zigzag shape. That is, the above-mentioned flat portions formed on the respective groove portions 91 arranged in parallel are arranged so as not to overlap at least one place in the lifting direction of the push plate 90 . In the groove part 91 formed in the resin supply surface P1, each recessed part (3rd recessed part 91c) located in both ends is continuously formed in the remaining 3 side surfaces of the push plate 90. As shown in FIG. In addition, the above-mentioned grooves 9...

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PUM

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Abstract

The present invention relates to a sealing device for resin, which is easy to provide resin materials, can reduce waste resin and shape cheaply after sealing the resin, and can be used at favorable state long-term. The sealing device for resin comprises a first metal mould (1) and a second metal mould (2) which can be connected and separated to the first metal mould (1). The molten resin at a kettle portion (59) are filled into a die cavity which is formed by the two metal modules (1 and 2) through a gate (48), thus the substrates (70) resin which is equipped with an electrical component and arranged between the two metal moulds (1, and 2) are sealed. The kettle portion is positioned in any one of the metal moulds, and is formed with dent (54c) which is divided with prescribe spacing. Thebottom surface of the dent (54c) is composed of one part of a moving component (60) which can move toward the opening. The moving component (60) is as plate shape, and at least one ditch portion (60a) is formed at any one side surface which across with the moving direction.

Description

technical field [0001] The invention relates to a resin sealing device, a moving part and a resin sealing method. Background technique [0002] Conventionally, as a resin sealing device, a resin sealing device having the following structure adopted in MAP (Matrix Array Packaging Method: matrix array packaging method) is known. It is a packaging method in which semiconductor devices are obtained by dicing each semiconductor element after sealing with a permanent resin. [0003] That is, Patent Document 1 discloses a structure in which resin melted in a plurality of pots flows through grooves (Japanese original: カル) in the opening above them through a plurality of runners, and passes through the grooves along the long sides of the cavity. The gate is filled into the cavity and sealed with resin. [0004] Furthermore, Patent Document 2 discloses a configuration in which a thermosetting resin sheet is accommodated in runners, a plunger is moved upward in each runner, and sheet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56B29C45/14B29C45/26B29C45/02B29C45/53B29L31/34
Inventor 西口昌志力丸诚
Owner DAIICHI SEIKO CO LTD