Cutting method of circuit board

A cutting method and circuit board technology, applied in the direction of clamping, supporting, positioning devices, etc., can solve the problems of uneven force, holes on the board, uneven force, etc., and achieve the effect of improving quality

Inactive Publication Date: 2009-02-11
KUNSHAN DINGXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] But when the size of the finished product is very small, it is impossible to make holes on the board
If it is cut directly, it will damage the circuit board due to uneven force
At present, when most manufacturers encounter this problem, they fix the circuit board by sticking tape on the board surface and then cut it. However, because the tape is not fixed firmly and the force is uneven, the cutting accuracy is often not high and it is easy to cause defects Angle, high scrap rate

Method used

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  • Cutting method of circuit board

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Embodiment Construction

[0023] The specific embodiments of the present invention will be described below in conjunction with the drawings:

[0024] The circuit board cutting method implemented according to the present invention includes the following steps:

[0025] 1. Typesetting: Arrange two L-shaped circuit board small pieces 2 symmetrically into a large piece 1, leaving a cutting position 3 between the two small pieces 2 and their outer edges. The size of the small piece is 5×5 mm, and positioning pins cannot be set in the board.

[0026] 2. One-time cutting: The purpose of this cutting is to cut out the positioning groove 4 for inserting the pin 5. In this embodiment, since the L-shaped circuit board has an S-shaped edge with a turning point, the S-shaped edge and its opposite side edges are selected as the edge for one cut. Cut along the upper, middle, and lower three cutting positions 3, and cut out three positioning grooves 4 with a width of 1 mm.

[0027] 3. Pin positioning: Insert the pin 5 int...

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Abstract

The invention relates to a method for cutting a circuit board, which comprises the following procedures: (1) typesetting-forming one piece of hunk by arranging at least two pieces of scraps and setting aside a cutting position outside each brink of each scrap; (2) one-time cutting-choosing a pair of opposite brinks on each scrap and cutting out a positioning slot along the cutting position outside of a pair of the opposite brinks; (3) pin positioning-choosing a plurality of pins with the sizes matched with the width of the positioning slot and respectively inserting the pins into the positioning slot; and (4) secondary cutting-cutting along the cutting position where cutting is not carried out. The method is applicable to the cutting of the circuit board with small size; drilling on a finished product of the circuit board is avoided; and the quality of the finished product is improved. The precision of the size of the cutting method can reach plus or minus 0.1mm, which is enough to meet the requirements for cutting the circuit boards of various norms.

Description

Technical field [0001] The invention relates to a method for cutting a circuit board. Background technique [0002] When making circuit boards, two or more circuit boards are often arranged into a large piece during typesetting to control costs and increase output. Then, after the production is completed, use a data cutting machine to cut the large piece into small pieces of finished circuit board. [0003] When cutting, you must first drill 3 or 4 positioning holes with a diameter of more than 1 mm at the position of each small piece of finished product, add pins in each hole, and fix the large pieces on the work surface through the pins. Then use a milling cutter to cut the complete finished shape along the edge of the small piece. [0004] But when the size of the finished product is very small, it is impossible to make holes in the board. If it is cut directly, the circuit board will be damaged due to uneven force. At present, when most manufacturers encounter this problem, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/00B23Q3/18
Inventor 蒲强文先志
Owner KUNSHAN DINGXIN ELECTRONICS
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