Light-emitting device, method for manufacturing light-emitting device, and substrate processing apparatus
A technology for a substrate processing device and a light-emitting element, which is used in electroluminescent light sources, semiconductor/solid-state device manufacturing, lighting devices, etc. Effect
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Embodiment 1
[0084] The method for manufacturing a light-emitting element of this embodiment is a method for manufacturing a light-emitting element in which an organic layer including a light-emitting layer is formed between a first electrode (anode electrode) and a second electrode (cathode electrode), and is characterized in that it includes : an organic layer forming step of forming the organic layer on the first electrode formed on the substrate; an electrode forming step of forming the second electrode on the organic layer; and an etching step of etching the organic layer.
[0085] That is, in this embodiment, it is characterized in that the above-mentioned patterning of the organic layer is performed by patterning by etching instead of vapor deposition using a mask. according to Figure 2A ~ Figure 2F , an example of such a method of manufacturing a light-emitting element will be described in order. In the following drawings, the same reference numerals are attached to the parts alr...
Embodiment 3
[0122] In addition, the manufacturing method of the light emitting element of this invention is not limited to this Example, As demonstrated below, various deformation|transformation and changes are possible.
Embodiment 2
[0124] Figure 3A ~ Figure 3G It is a diagram showing in order the manufacturing method of the light-emitting element of Example 2 of the present invention. In the following figures, the same reference numerals are attached to the parts that have been described previously, and description thereof will be omitted.
[0125] first, Figure 3A ~ Figure 3D The procedure shown is equivalent to that of Example 1 Figure 2A ~ Figure 2D process shown. The substrate 201, anode electrode 202, lead wire 203, organic layer 204 and cathode electrode 205 of this embodiment are respectively equivalent to the substrate 101, anode electrode 102, lead wire 103, organic layer 104 and cathode electrode 105 of Embodiment 1, and can be It is formed with the same material and the same method as described in Example 1.
[0126] In the present embodiment, the shape of the cathode electrode 205 is different from that of the first embodiment, and the area of the cathode electrode 205 is small. Thu...
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