In-mold film with 2D or 3D pattern

Abstract

An intramode film with 2D or 3D patterns comprises a substrate layer, a pattern layer, a protection layer and a bond layer, wherein, the pattern layer is a 2D pattern which appears like a mirror image and is printed on the inner surface of the substrate layer in advance, or is a 3D pattern printed on the substrate layer made from grating material, subsequently, a protection layer with the properties like high temperature and acid and alkaline resistance is printed on the 2D or 3D pattern layer, then the bond layer is coated on the protection layer, or according to requirements, a layer of materials resisting EMI is beforehand coated between the protection layer and the bond layer to avail the function of shielding electromagnetic wave. The intramode film is specially and directly compounded with a product component layer by matching with injection molding to lead the product component to have various integrally formed and selected patterns such as 2D or 3D patterns, and the like.

Description

technical field [0001] The invention provides an in-mold film with a 2D or 3D pattern, which is to print a protective layer on the 2D or 3D pattern layer to cooperate with injection or extrusion molding and to be integrally combined with the component layer of the selected product, so that the component layer has an integrated Formed 2D or 3D patterns. The invention belongs to the in-mold film technology. Background technique [0002] For the well-known technologies such as in-mold film injection molding (IMF) or in-mold labeling (IML), the former is commonly used in notebook computers, palmtop computers, wireless communications, consumer electronics, communication and telecommunication systems, Internet appliances, automobiles, etc. The shells of various products such as mechanical parts and home appliances; the manufacture of in-mold labeling has also become popular in related industries, and the products are also widely used in mobile phones, buttons, IT products, food c...

AI Technical Summary

Problems solved by technology

[0003] For the currently used product components, neither the lenticular material itself nor the pattern ink used in the 2D or 3D pattern can withstand the high temperature environment in the IMF or IML manufacturing process, so the lenticular material or The ink is thermally melted and deformed, and the original state of the pattern cannot be maintained at all, resulting in the pasting of the pattern. Therefore, lamination or embedding is usually used to combine the single piece of 2D or 3D pattern with the product component, but it is still impossible to integrate 2D Or the 3D pattern and product components are truly integrated, and the overall appearance and quality are not good, which cannot meet the needs of mass production and high quality

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