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A kind of method for making polyimide organic hollow film

A technology of polyimide and polyimide glue is applied in the field of making polyimide organic hollow films, which can solve problems such as inconvenience of use, and achieve the effects of high yield, low price and low cost.

Active Publication Date: 2012-02-15
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thickness of the imported KAPTON polyimide film available in the market is fixed, which is very inconvenient to use in microelectronics processing technology and device applications.

Method used

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  • A kind of method for making polyimide organic hollow film
  • A kind of method for making polyimide organic hollow film
  • A kind of method for making polyimide organic hollow film

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Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0035] Such as figure 1 as shown, figure 1 It is a flow chart of the method for preparing polyimide hollow film provided by the present invention, the method comprising:

[0036] Step 101: cleaning and drying the substrate; the substrate includes various types of silicon wafers and fused silica.

[0037] Step 102: spin coating a certain thickness of polyimide glue on the surface of the substrate;

[0038] Step 103: performing heat treatment on the substrate;

[0039] Step 104: After cooling, put the substrate into a well-sealed jig and put it into an acidic etching solution for etching;

[0040] Step 105: After etching, take out the hollowed-out substrate, clean and dry it.

[0041] In the above step 103, the conditi...

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Abstract

The invention discloses a method for preparing a polyimide hollow film. The method comprises: cleaning and drying a substrate; spin-coating a certain thickness of polyimide glue on the surface of the substrate; heat-treating the substrate; cooling Finally, put the substrate into a well-sealed jig and put it into an acidic etching solution for etching; after the etching is completed, take out the hollowed-out substrate, clean it, and dry it. The method for preparing the polyimide hollow film provided by the invention has the remarkable advantages of low cost, high yield and high efficiency.

Description

technical field [0001] The invention relates to the technical fields of microelectronics, micromechanics and X-ray optics, in particular to a method for making a polyimide organic hollow film, specifically referring to a method that can be used in microelectronic technology, various microelectromechanical systems and X-ray optical elements A preparation method of a new type of hollow film based on polyimide is widely used in the field, which directly affects the precision of micro / nano structures on microelectronics, micromechanics, micro optics and other devices and the performance of these devices. Background technique [0002] Self-supporting hollow film is the mask structure of X-ray lithography and electron beam projection lithography in microelectronics technology. Many micro-electromechanical systems such as uncooled infrared detectors and surface acoustic wave transducers are also made of self-supporting hollow films. The composition of the film structure, especially...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08J9/26
Inventor 朱效立谢常青叶甜春刘明
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI