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Cluster tool for advanced front-end processing

A kind of equipment and process technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of time-consuming, yield impact, complex problems, etc.

Inactive Publication Date: 2009-07-15
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, known measurement inspection methods add significantly to the overhead time of chip fabrication. In addition, due to the negative impact on yield, such inspection methods only periodically sample many contaminated substrates. Manufacture of defective components by handling without inspection
The problem is compounded if it is difficult to trace the source of contamination from a particular batch of substrate because it was redistributed

Method used

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  • Cluster tool for advanced front-end processing
  • Cluster tool for advanced front-end processing
  • Cluster tool for advanced front-end processing

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Embodiment Construction

[0072] The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (eg, a cluster apparatus) suitable for processing substrates and analyzing the results of processes performed on the substrates. In one aspect of the invention, one or more analysis steps and / or pre-cleaning steps are used to reduce the impact of waiting time on module yield. In one aspect of the invention, a system controller and one or more analysis chambers are used to monitor and control process chamber recipes and / or process sequences to reduce substrate scrap and component performance due to defects on formed components change problem. Embodiments of the present invention generally also provide methods and systems for repeatable and reliable formation of semiconductor components for use in various applications. The invention is exemplified below with reference to a Centura device available from the FEP division of Applied Materials, S...

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Abstract

Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and / or precleaning steps are utilized to reduce the effect of queue time on device yield. In one aspect of the invention, a system controller and the one or more analysis chambers are utilized to monitor and control a process chamber recipe and / or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

Description

technical field [0001] Embodiments of the present invention generally relate to an integrated processing system configured to execute a processing sequence, which includes a substrate processing module, a substrate preparation chamber, and / or process verification and Both chambers are analyzed. Background technique [0002] The process of forming semiconductor devices is usually performed in a multi-chamber process system, such as a cluster tool, which has the capability of processing substrates (eg, semiconductor wafers) under a controlled process environment. A typical controlled process environment includes a system having a main frame housing a substrate transfer robot in a load lock chamber connected to the main frame and a plurality of vacuum processing chambers Transfer substrates between. A controlled process environment has many benefits, including the ability to minimize contamination of substrate surfaces during transfer and completion of various substrate proce...

Claims

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Application Information

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IPC IPC(8): H01L21/00
Inventor R·塔库尔A·萨摩罗伏P·汉森
Owner APPLIED MATERIALS INC
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