Cluster tool for advanced front-end processing

A kind of equipment and process technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of time-consuming, yield impact, complex problems, etc.

Inactive Publication Date: 2009-07-15
APPLIED MATERIALS INC
View PDF14 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, known measurement inspection methods add significantly to the overhead time of chip fabrication. In addition, due to the negative impact on yield, such inspection methods only periodically sample many contaminated

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cluster tool for advanced front-end processing
  • Cluster tool for advanced front-end processing
  • Cluster tool for advanced front-end processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0072] The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (eg, a cluster apparatus) suitable for processing substrates and analyzing the results of processes performed on the substrates. In one aspect of the invention, one or more analysis steps and / or pre-cleaning steps are used to reduce the impact of waiting time on module yield. In one aspect of the invention, a system controller and one or more analysis chambers are used to monitor and control process chamber recipes and / or process sequences to reduce substrate scrap and component performance due to defects on formed components change problem. Embodiments of the present invention generally also provide methods and systems for repeatable and reliable formation of semiconductor components for use in various applications. The invention is exemplified below with reference to a Centura device available from the FEP division of Applied Materials, S...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or precleaning steps are utilized to reduce the effect of queue time on device yield. In one aspect of the invention, a system controller and the one or more analysis chambers are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

Description

technical field [0001] Embodiments of the present invention generally relate to an integrated processing system configured to execute a processing sequence, which includes a substrate processing module, a substrate preparation chamber, and / or process verification and Both chambers are analyzed. Background technique [0002] The process of forming semiconductor devices is usually performed in a multi-chamber process system, such as a cluster tool, which has the capability of processing substrates (eg, semiconductor wafers) under a controlled process environment. A typical controlled process environment includes a system having a main frame housing a substrate transfer robot in a load lock chamber connected to the main frame and a plurality of vacuum processing chambers Transfer substrates between. A controlled process environment has many benefits, including the ability to minimize contamination of substrate surfaces during transfer and completion of various substrate proce...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/00
Inventor R·塔库尔A·萨摩罗伏P·汉森
Owner APPLIED MATERIALS INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap