Substrate packaging structure

A technology for packaging structures and substrates, which is applied in the directions of transportation and packaging, packaging of vulnerable items, types of packaging items, etc., can solve the problems of increasing the cost of mold opening of the substrate packaging structure 100 and the burden of inventory management, and saves mold production. Costs and inventory management costs, the effect of a good pack load rate

Inactive Publication Date: 2009-07-22
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, since the size of the accommodating space 116 is fixed when the box body 110 is molded, the single substrate packaging structure 100 is only suitable for packaging substrates of a single size.
[0004] However, with the diversification of the sizes of flat-panel displays today, manufacturers must open molds to manufacture substrate packaging structures of various sizes according to substrates of various sizes 100
As a result, not only increases the mold opening cost of the substrate packaging structure 100, but also causes a considerable burden on the inventory management of these substrate packaging structures

Method used

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Embodiment Construction

[0037] Figure 2A It is a three-dimensional exploded schematic view of the substrate packaging structure in an embodiment of the present invention, Figure 2B It is a schematic cross-sectional view of the substrate packaging structure in an embodiment of the present invention. Please refer to Figure 2A and Figure 2B , the substrate packaging structure 200 includes a box body 210 , a lining body 220 and a cover body 230 . Wherein, the material of the box body 210, the lining body 220 and the cover body 230 is, for example, expanded polypropylene (Expanded Polypropylene Foam, EPP) or expanded polystyrene (Expanded Polystyrene Foam, EPS), but the present invention is not limited thereto .

[0038] Based on the above, the box body 210 is composed of a bottom plate 212 and a plurality of side plates 214 , and the side plates 214 are connected to the bottom plate 212 to enclose a first accommodating space 216 . The liner 220 is detachably disposed in the first accommodation s...

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Abstract

The invention discloses a packing structure of a substrate, which comprises a case body, a liner body and a lid body, wherein the case body comprises a bottom plate and a plurality of lateral plates which are connected with the bottom plate, and a first containing space is formed by the encirclement of the lateral plates and the bottom plate; the liner body is detachably configured in the first containing space and provided with a plurality of buffer walls which are higher than the lateral plates, and a second containing space is formed by the encirclement of the buffer walls along the lateral plates and the bottom plate in the first containing space; and the lid body is covered above the case body. The packing structure of the substrate can change the liner body according to the size of the substrate to be packed, and the buffer walls of the liner body are higher than the lateral plates of the case body, thus not only saving mould manufacturing cost and inventory management cost of the packing structure of the substrate, but also having good packing loading rate.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a glass substrate packaging structure. Background technique [0002] With the development of semiconductor and display industry technologies, flat panel displays have been widely used in daily life. In the manufacturing process of the flat panel display, since the glass substrate is easily damaged during transportation and cannot be used, the display industry has strict requirements on the packaging and transportation of the glass substrate. [0003] figure 1 It is a three-dimensional exploded schematic diagram of a known substrate packaging structure. Please refer to figure 1 , the substrate packaging structure 100 includes a box body 110 and a cover body 120 , wherein the box body 110 is composed of a plurality of side panels 112 and a bottom panel 114 . The side panels 112 and the bottom panel 114 define an accommodating space 116 for accommodating a glass substrate (not sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/48B65D81/05
Inventor 范植钧陈士琦谢坤宏苏宏积
Owner AU OPTRONICS CORP
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