Unlock instant, AI-driven research and patent intelligence for your innovation.

Apparatus and method for high speed signals on a printed circuit board

A printed circuit board, high-speed signal technology, applied in the direction of printed circuits, printed circuits, printed circuit components, etc.

Inactive Publication Date: 2009-10-28
INTEL CORP
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The effect of dispersion and attenuation on electronic system design is to limit the distance between electronic devices to a distance that will limit the effects of dispersion and attenuation, and to limit the maximum frequency that can be used to transmit signals

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for high speed signals on a printed circuit board
  • Apparatus and method for high speed signals on a printed circuit board
  • Apparatus and method for high speed signals on a printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] For purposes of illustration and not limitation, the following description is set forth in specific details such as specific structures, architectures, interfaces, techniques, etc., in order to provide a thorough understanding of the various aspects of the invention. However, it will be apparent to those skilled in the art having the benefit of this disclosure that various aspects of the invention may also be practiced in other examples that depart from these specific details. In certain instances, descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0018] refer to figure 1 , the electronic device 10 according to some embodiments of the present invention may include a printed circuit board substrate 12, a copper signal line 14 disposed on the printed circuit board substrate 12, and a nonlinear transmission structure 16 coupled to the copper signal line 14, wherein ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In some embodiments, an apparatus includes a printed circuit board substrate, a copper signal line disposed on the printed circuit board substrate, and a nonlinear transmission structure coupled to the copper signal line, wherein the nonlinear transmission structure is configured to sharpen a wavefront of a high speed signal pulse on the copper signal line. In some embodiments, the nonlinear transmission structure may include a voltage dependent dielectric layer on the printed circuit board substrate. In some embodiments, the voltage dependent dielectric layer may include a plurality of varactors positioned at a receiving end of the signal line.

Description

technical field [0001] The present invention relates to the use of nonlinear transmission structures to improve the signal quality of high speed printed circuit board interconnects. Background technique [0002] One of the challenges of using copper transmission lines for high speed signals is that transmission lines are passive linear conductors which tend to reduce signal strength (attenuation) and tend to reduce rise and fall times (dispersion). [0003] Since attenuation and dispersion affect the differential signal, the receiver needs to be more sensitive to small voltages and narrower timings in which the signal can be sampled. The effect of dispersion and attenuation on electronic system design is to limit the distance between electronic devices to a distance that will limit the effects of dispersion and attenuation, as well as to limit the maximum frequency that can be used to transmit signals. Contents of the invention Description of drawings [0004] Various f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/08H05K1/02
CPCH05K1/167H05K1/024H01P3/08H05K2201/10196H05K2201/0738H05K1/0254H01P3/00H05K1/023H05K1/0237
Inventor E·C·汉娜J·C·莫里斯
Owner INTEL CORP