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Epoxy resins comprising a cycloalphatic diamine curing agent

A technology of epoxy resin and curing agent, which is applied in the direction of epoxy resin coating and coating, and can solve the problem of low curing rate of epoxy resin

Active Publication Date: 2012-06-13
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These cycloaliphatic diamines produce resins with good coating properties but suffer from the slow cure rate of epoxy resins

Method used

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  • Epoxy resins comprising a cycloalphatic diamine curing agent
  • Epoxy resins comprising a cycloalphatic diamine curing agent
  • Epoxy resins comprising a cycloalphatic diamine curing agent

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Experimental program
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preparation example Construction

[0030] The preparation of the amine curing agent mixtures disclosed herein can result in the formation of impurities such as bicyclic amines, bicyclic diamines, and bicyclic imines. In some embodiments, the various isomers of bis(aminomethyl)cyclohexane can be purified and recovered via separation processes such as distillation.

[0031] In some embodiments, the amine curing agent mixture may contain various impurities, such as impurities that may form during the preparation of the curing agent. For example, the amine curing agents disclosed herein may comprise bicyclic amines such as 3-azabicyclo[3.3.1]nonane, bicyclic imines such as 3-azabicyclo[3.3.1]non-2-ene, and bicyclic diamines such as 3-azabicyclo[3.3.1]nonan-2-amine. In some embodiments, the amine curing agent mixtures disclosed herein may comprise 50 to 100% by weight of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane in cis A mixture of formula and trans isomers, and at least one of the follow...

Embodiment 1

[0093] To evaluate the curing reaction of epoxy resins with cycloaliphatic diamines, differential scanning calorimetry (DSC) was employed. Bisphenol A based epoxy resin (commercially available from Shell 828) with diamines (amine curing agent mixtures containing cis and trans isomers of 1,3-bis(aminomethyl)cyclohexane and 1,4-ylidene(aminomethyl)cyclohexane, herein called in Diamine (sample 1), or isophorone diamine (IPDA) (comparative sample 1)) was mixed in an equivalent ratio of 1:1, and heated at a rate of 1 °C / min from 20 °C to 120 °C in DSC Curing reaction studies were performed. The curing temperature is considered to be the temperature at which the heat flow reaches the maximum in the heat flow versus temperature curve of the reaction. Diamine and The curing reaction of 828 shows a peak at 65.14 °C because the two amine groups have similar reactivity, while isophorone diamine (IPDA) and The curing reaction of 828 shows two peaks at 69.75 °C and 93.69 °C, whic...

Embodiment 2

[0098] will contain Diamine prepolymer curing agent formulation (sample 2) and industry standard curing agent 1618 (available from Air Products) (Comparative Sample 2) for comparison. Add 20% benzyl alcohol to the Diamine prepolymer curing agent formulation. D.E.R. 331 was used as epoxy resin in both formulations. Each formulation was coated on cold rolled steel (approximately 10mm wet thickness). The weight percent of each formulation is shown in Table 2. The physical properties of these formulations are shown in Table 3 using the industry standard tests annotated in the table.

[0099] As can be seen from Table 3, prepolymers containing cis and trans isomers of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane cured The formulation of the agent (Formulation 2) showed better pencil hardness and pendulum hardness from the beginning (Day 1) and maintained better hardness (Day 7). and industry standard Compared to 1618, formulations of prepolymer cu...

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Abstract

A hardener composition for epoxy resins, the hardener composition including a mixture of l,3-bis(aminomethyl)cyclohexane and l,4-bis(aminomethyl)cyclohexane. A prepolymer hardener composition for epoxy resins, the prepolymer hardener composition comprising the reaction product of an epoxy with a mixture of 1,3- bis(aminomethyl)cyclohexane; and l,4-bis(aminomethyl)cyclohexane.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Application No. 60 / 993,288, filed September 11, 2007, and US Provisional Application No. 60 / 860,128, filed November 20, 2006, which are hereby incorporated by reference. technical field [0003] Embodiments disclosed herein generally relate to curing agent compositions. Particular embodiments disclosed herein relate to curing agent compositions for epoxy resin systems. Background technique [0004] One area of ​​ongoing research in chemical development is the formulation of curing agents that are compatible with conventional epoxy resins at low curing temperatures and are sufficiently reactive with epoxy resins that the system will cure over a wide range of temperatures. Curing agents that cure within 24 hours at low temperatures in the absence of external accelerators are particularly desirable. [0005] Typical amine curing agents, whether aliphatic, aromatic or ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50
CPCC08G59/5006C08L63/00C09D163/00C08G59/50C08K5/17C08J3/02
Inventor 约翰·N·阿吉罗普洛斯德布库马·巴塔查吉拉杰什·H·图拉基亚
Owner DOW GLOBAL TECH LLC