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Method for processing buried resistor in printed circuit board

A technology for printed circuit boards and processing methods, applied in the direction of assembling printed circuits, circuits, resistors, etc. with electrical components, can solve the problems of high cost, narrow application range of buried resistance process, and complicated operation, and achieve the effect of improving deviation

Active Publication Date: 2012-05-09
SHANGHAI MEADVILLE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the laser correction technology can realize the processing of high-precision fine resistors, the operation is generally cumbersome and the cost is extremely high, so the scope of use in the buried resistor process is narrow

Method used

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  • Method for processing buried resistor in printed circuit board
  • Method for processing buried resistor in printed circuit board
  • Method for processing buried resistor in printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] The material with 50 ohm square resistance is used, and the target resistance of 250 ohm is processed.

[0098] Calculation: The resistance width a is set to 500um. According to experience, the resistivity R′ of the 50 ohm square resistance material is corrected after the process S is 51.55, then the resistance etching length b' is 250 / 51.55*500-10=2414.83um, where 250 is the target resistance value, and 10 is the etching compensation amount. In order to facilitate the needs of the experimental test, the addition of the resistance etching width does not adopt the conventional addition value (5um-300um) in this embodiment, but a' is determined as a'=500+3000=3500um.

[0099] Lamination: see Figure 8 1. Laminate the resistive copper foil 10 and the dielectric layer 4 made of common dielectric materials such as FR4 to form a printed circuit board 20 with a resistive layer 1 in the inner layer.

[0100] First etch: see Figure 9 , according to the size of 600um for ordi...

Embodiment 2

[0104] Using 25 ohm square resistance material, the target resistance of 2500 ohm is processed.

[0105] 1. Calculate:

[0106] a) Adopt serpentine resistance design, a total of 10 resistance strips are connected in series. Set the theoretical resistance width a=250um, and the spacing is 100um.

[0107] b) According to experience, the resistivity R′ of materials with 25 ohm square resistance after correction process S For 25.25, the corner top resistance at the corner must be multiplied by a factor of 0.559. In this design, there are 10 vertical resistors, 9 horizontal resistors and 18 corner resistors, then the theoretical length b can be calculated by the following formula: b=2133.70um

[0108] b 250 × 10 + 100 250 × 9 + 18 × 0.559 = 2500 25.25

[0109] Conside...

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Abstract

The invention discloses a method for processing a buried resistor in a printed circuit board. The method is characterized in that the width and length of the resistor are precisely controlled by laser cutting with a laser driller based on etching compensation. The method can effectively overcome the deviation of resistance precision caused by lateral erosion factors. The deviation of resistance precision in the process of the invention can be controlled to be less than or equal to 10 percent. Though the method cannot control the resistance precision to 1 percent, the precision of the buried resistor can be greatly improved without increasing the investment cost of common PCB factory equipment. Therefore, the method has great practical advantage in use.

Description

technical field [0001] The invention relates to a processing method of a buried resistor in a printed circuit board, which can improve the precision of the resistance value of the buried resistor. The invention is suitable for the buried resistance technology of printed circuit board (PCB). Background technique [0002] With the development of electronic products in the direction of short, light, thin and multi-functional modular integration, the motherboard-PCB board as the installation component also requires finer and denser circuits, and also requires more mounting space for active chips. , Therefore, buried passive devices, such as buried capacitors, resistors and inductors, have gradually become an inevitable trend in the development of PCBs. Buried passive device technology can not only reduce mounting costs, but also reduce the size of the board under the same design conditions. Since the passive components are embedded in the PCB, the signal transmission distance ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K1/16H01C17/242
Inventor 屈刚赵国强黄伟吴金华罗永红陈培峰
Owner SHANGHAI MEADVILLE ELECTRONICS