Illuminating device
A technology for lighting devices and cooling devices, which is applied to lighting devices, components of lighting devices, and damage prevention measures for lighting devices. Guaranteed the effect of luminous characteristics
Inactive Publication Date: 2010-01-20
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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Problems solved by technology
However, due to the limited chemical and physical properties of the heat dissipation adhesive, aging phenomenon (aging phenomenon) will occur after long-term use, that is, the heat dissipation adhesive evaporates, loses, and lacks elasticity, so that the connection between the circuit board and the heat sink will appear. loose
When air gaps or air bubbles appear between the circuit board and the heat sink due to loose connections, the thermal connection between the circuit board and the heat sink will be destroyed, and after the heat emitted by the light-emitting diodes is conducted to the circuit board, It is difficult to further conduct to the heat sink for heat dissipation
Method used
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Embodiment Construction
[0011] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0012] see figure 1 , a lighting device 10 provided by the first embodiment of the present invention includes at least one solid-state light source 11 , a circuit board 13 , a heat sink 15 and at least one elastic element 17 .
[0013] The at least one solid-state light source 11 can be a plurality of light emitting diodes, and the plurality of light emitting diodes can be white light emitting diodes or colored light emitting diodes, such as red, green, blue light emitting diodes and the like.
[0014] The circuit board 13 can be a ceramic circuit board, a glass fiber (FR4) circuit board, or preferably a metal core circuit board (Metal Core PCB, MCPCB). The at least one solid-state light source 11 is disposed on the circuit board 13 and electrically connected to the circuit board 13 . Through an external power supply, the circuit board 13...
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The invention relates to a piece of illuminating device, which comprises a radiating device, a circuit board, at least one solid light source and at least one elastic element. The radiating device comprises a body and a plurality of radiating fins extended from the body. The circuit board is arranged on the body of the radiating device and is thermally connected with the body through radiating glue. The at least one solid light source is arranged on the side, far way from the body, of the circuit board. The elastic element is connected with the radiating device and the circuit board respectively so as to allow the radiating device and the circuit board to be jointed with the radiating glue respectively. As the elastic element is provided to connect the radiating device and the circuit board to allow the radiating device and the circuit board to be jointed through the radiating glue, illuminating device guarantees the heat radiated by the at least one solid light source is transferred to the radiating device through the circuit board and the radiating glue, thereby achieving a guaranteed lighting characteristic of the illuminating device.
Description
technical field [0001] The invention relates to an illuminating device, in particular to an illuminating device with relatively stable heat dissipation performance. Background technique [0002] At present, light emitting diodes (Light Emitting Diode, LED) are gradually replacing fluorescent lamps (Fluorescent Lamp) due to their good light quality and high luminous efficiency, and have become light-emitting elements in lighting devices. For details, please refer to Michael S.Shur et al. "Solid-State Lighting: Toward Superior Illumination" published in of the IEEE, Vol.93, No.10 (October 2005). [0003] The stability of the light-emitting diodes during use is easily affected by the surrounding temperature. For example, when the temperature is too high, the luminous intensity of the light-emitting diodes is likely to attenuate, resulting in a shortened service life. In the current technology, the light-emitting diodes are usually installed on the circuit board, and the circui...
Claims
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IPC IPC(8): F21V29/00F21V15/04H01L23/373F21Y101/02
CPCF21V29/2206F21V19/005F21V29/004F21V17/162F21V29/225F21Y2101/02F21V29/24F21V29/74F21V29/763F21V29/85F21Y2115/10
Inventor 江国丰郑伊凯吕英杰谌秉佑徐弘光
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC