Thermoelectric cooler and illuminating apparatus adopting same

Abstract

The invention relates to a thermoelectric cooler which comprises a plurality of P-type semiconductor columns, a plurality of N-type semiconductor columns, a plurality of connecting circuits, one cool end and one hot end. The P-type semiconductor columns and the N-type semiconductor columns are electrically connected by the connecting circuits. The P-type semiconductor columns, the N-type semiconductor columns and the connecting circuits are clamped between the cool end and the hot end and respectively and thermally connected with the cool end and the hot end. The cool end comprises a first metal plate and a first metal oxide insulation film which is formed on the first metal plate and positioned at one side of the first metal plate, which is adjacent to the P-type semiconductor columns, the N-type semiconductor columns and the connecting circuits. Furthermore, the invention also relates to an illuminating apparatus adopting the thermoelectric cooler for heat conduction.

Description

technical field [0001] The invention relates to a thermoelectric cooler, in particular to a thermoelectric cooler with better heat dissipation efficiency, and an illuminating device using the thermoelectric cooler. Background technique [0002] Currently, Light Emitting Diodes (LEDs) are gradually replacing Cold Cathode Fluorescent Lamps (CCFLs) as light-emitting elements in lighting devices due to their good light quality and high luminous efficiency. For details, please refer to Michael S. "Solid-State Lighting: Toward Superior Illumination" by Shur et al., IEEE Systems, American Control Conference (October 2005). [0003] The stability of the light-emitting diodes during use is easily affected by the surrounding temperature. For example, when the temperature is too high, the luminous intensity of the light-emitting diodes is likely to attenuate, resulting in a shortened service life. [0004] Usually, in order to dissipate the heat emitted by the light-emitting diodes qu...

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Problems solved by technology

[0005] The hot end and the cold end of the existing thermoelectric cooler are usually insulating materials, such as ceramics, etc., which have a large thermal resistance, so that the heat dissipation efficiency of the existing thermoelectric cooler is low, and in the prior art, the thermoelectric Thermally conductive glue, such as silver glue, is usually used between the cold end of the cooler and the circuit board, and between the hot end of the thermoelectric cooler and the heat sink, to connect the thermoelectric cooler with the circuit board and the heat sink. The thermal resistance of the thermal conductive adhesive is relatively large, which further reduces the heat dissipation efficiency of the thermoelectric cooler.

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