Inspecting method and inspecting equipment

Abstract

An inspecting method and inspecting equipment including a dividing unit, a determining unit, a transferring unit and an inspecting unit for inspecting a disk are provided. The inspecting method includes the following steps. First, a plane is divided into several zones with equal area. Next, several measuring locations are determined within these zones. Next, these measuring locations are transferred into several sets of measuring locations corresponding to the disk through a coordinate transfer. Then, the disk is inspected according to these sets of measuring locations.

Description

Technical field [0001] The invention relates to a detection method, and more particularly to a detection method and a detection device for detecting a disc. Background technique [0002] With the advent of the digital electronics era, semiconductor chips have been widely used in various electronic devices, and the market for semiconductor chips has become increasingly demanding. Therefore, the technology that can produce a large number of semiconductor chips at a low cost is constantly seeking improved methods. Generally, the manufacturing process of semiconductor chips includes the step of using an inspection device for inspection, which is to inspect the surface of the wafer during the production process of the wafer, so as to display the current process status through the inspection result. Furthermore, the abnormality of the process quality can be reflected in the process, so as to monitor the process quality. Therefore, the determination of the location of the measurement ...

AI Technical Summary

Problems solved by technology

[0004] However, since the measurement points 13 are distributed in concentric circles, and the measurement positions of each wafer are the same, the measurement results can only reflect the conditions of the concentric circles, but cannot fully express the conditions of the overall manufacturing process, and thus cannot effectively monitor the manufacturing process in real time the quality of

In addition, the location and number of measuring points 13 cannot effectively match the detection sensitivity to be achieved

That is to say, the existing detection methods and detection devices cannot effectively change the detection sensitivity by correspondingly adjusting the positions and numbers of the measurement points 13, which greatly limits the application flexibility of the detection methods and detection devices.

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