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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which are applied in the directions of printed circuit components, secondary processing of printed circuits, and electrical connection of printed components, etc., can solve the problems of surface creases and indentations in the chemical gold area, and poor product appearance quality.

Active Publication Date: 2011-12-07
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology

[0003] At present, gold plating is usually achieved by chemical gold, but the gold formed in the process of chemical gold is relatively soft, and operations such as text printing, baking, and stamping after chemical gold are likely to cause creases and indentations on the surface of the chemical gold area. Poor product appearance quality

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0016] The manufacturing method of the circuit board 100 of the technical solution will be described in detail below with reference to the drawings and embodiments.

[0017] Step 1: providing a circuit substrate 110 .

[0018] The circuit substrate 110 may be a single-sided circuit substrate, a double-sided circuit substrate or a multi-layer circuit substrate with common structures in the art. see figure 1 The circuit substrate 110 used in this embodiment is a double-sided circuit substrate, which includes an insulating base material layer 111 and conductive circuits 112 and 113 located on opposite surfaces of the insulating base material layer 111 .

[0019] In the second step, see figure 2 , forming the gold layer 120 at a predetermined position on the surface of the conductive circuit 112 of the circuit substrate 110 .

[0020] The method of forming the gold layer 120 adopts electroless gold plating. It includes the following steps: first, degreasing treatment and micr...

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Abstract

The invention relates to a circuit board, which comprises a layer of insulating base material layer, a conductive line and an insulating layer are formed on one surface of the insulating base material layer, a plurality of openings are formed in the insulating layer, and each conductive line is only Arranged in the corresponding opening, the outer surface of the conductive circuit is formed with a gold layer, and a protective layer is formed only on the surface of the insulating layer, and an outer circuit is formed on the protective layer. The present invention also relates to a manufacturing method of the above-mentioned circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] During the production process of the circuit board, the plug-in terminal of the circuit board is usually plated with a layer of high hardness and wear-resistant nickel layer and a layer of highly chemically passive metal (commonly known as gold finger) to protect the terminal and provide good connection. performance. See literature Watanabe.Y., PWB surface finish process development to enhance the reliability of the solder joint strength, Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on 11-14 March 2001 Page(s): 165-170. [0003] At present, gold plating is usually achieved by chemical gold, but the gold formed in the process of chemical gold is relatively soft, and operations such as text printing, baking, and stamping after c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/22H05K3/40
Inventor 黄伟郭呈玮黄小群林承贤
Owner AVARY HLDG (SHENZHEN) CO LTD
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